实现高效率低损伤研磨加工的磨料优化研究

大功率激光系统对于熔石英光学元件提出了苛刻的加工要求,研磨作为加工环节之一,对于光学元件的加工周期和损伤控制具有非常重要的作用。采用计算机控制小磨头方法进行研磨加工时,在加工工艺参数相同的条件下,磨料是直接决定效率和损伤的关键因素。本文分别从材料去除效率和研磨加工损伤两方面对磨料进行对比分析,通过理论仿真得出磨料的规律特性,再结合实验研究进行规律验证,基于高效率和低损伤进行磨料优化选取,并讨论分别给出粗研、精研的磨料和工艺。

Research on Optimization of Abrasive in High Efficiency and Low Damage Lap-ping

Large power laser system has put forward harsh processing requirements for fused quartz optical elements, lapping as one of the processing links, has a very important role on the processing cycle and damage control. Using computer controlled optical surface, the abrasive is the key factor to directly determine the efficiency and damage under the same condition of processing parameters. The material removal efficiency and subsurface damage are compared and analyzed, and the regularity characteristics of abrasive are obtained through theoretical simulation, and the results are verified by experiment, and the abrasive optimization is chosen based on high efficiency and low damage regularity, and the coarse lapping and fine lapping craft are discussed.