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仿生毛细芯平板热管性能研究
引用本文:李红传,纪献兵,徐进良. 仿生毛细芯平板热管性能研究[J]. 航空动力学报, 2017, 32(10): 2403-2309. DOI: 10.13224/j.cnki.jasp.2017.10.013
作者姓名:李红传  纪献兵  徐进良
作者单位:1.华北电力大学 能源动力与机械工程学院 低品位能源多相流与传热北京市重点实验室,北京 102206
基金项目:国家自然科学基金项目(51676071);中核核反应堆热工水力技术重点实验室开放基金;国家自然科学基金重点项目(51436004)
摘    要:为解决电子设备热管理问题,根据亲水性植物叶片表面微观凸起结构,以颗粒直径为75μm的电解铜粉为材料烧结制备了锥形毛细芯,制造了3种平板热管:普通蒸发段(No.1)、超亲水蒸发段(No.2)、超亲水蒸发段与超疏水冷凝段匹配(No.3)。以去离子水为工质,研究了加热功率、角度等因素对3种平板热管热性能的影响。结果表明:角度对3种平板热管的热性能影响不大,3种平板热管均具有较好的抗重力特性。超亲水蒸发段与超疏水冷凝段匹配的平板热管热性能最佳,当倾斜角为0°、加热功率为140.4W时,蒸发段中心点温度仅为67.0℃。超亲水蒸发段与超疏水冷凝段匹配的平板热管不仅具有最小蒸发热阻,最小值可达0.05K/W,而且具有最小冷凝热阻,最小值可达0.02K/W。 

关 键 词:电子设备   冷却   抗重力   平板热管   亲水性   疏水性   传热
收稿时间:2016-03-11

Investigation on the performance of bionic wick flat heat pipes
LI Hongchuan,JI Xianbing,XU Jinliang. Investigation on the performance of bionic wick flat heat pipes[J]. Journal of Aerospace Power, 2017, 32(10): 2403-2309. DOI: 10.13224/j.cnki.jasp.2017.10.013
Authors:LI Hongchuan  JI Xianbing  XU Jinliang
Abstract:To solve the thermal management problem of electronic equipments,according to the micro convex structure of the hydrophilic plant,three flat heat pipes:normal evaporator (No.1),super-hydrophilic evaporator (No.2),the matched super-hydrophilic evaporator and super-hydrophobic condenser (No.3) were constructed with conical capillary wicks,using electrolytic copper powder of the particle diameter 75 μm as sintering material.Experiments were conducted to study the effect of heating power Q and tilt angle on the three flat heat pipes with deionized water as the working fluid.The results show that angle almost has no effect on the three flat heat pipes,namely,the three flat heat pipes all have good anti-gravity performance.The No.3 flat heat pipe has the best thermal performance;when tilt angle of 0° and Q=140.4 W,the central point temperature of the evaporation is just 67.0℃.The No.3 flat heat pipe has not only the smallest evaporation thermal resistance,but also the smallest condensation thermal resistance,which can reach to 0.05 K/W,0.02 K/W,respectively.
Keywords:electronic equipment  cooling  anti gravity  flat heat pipe  hydrophilic  hydrophobic  heat transfer
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