Improving Mode II delamination resistance of curved CFRP laminates by a Pre-Hole Z-pinning (PHZ) process

This paper presents an experimental investigation of the Mode II delamination resistance of curved CFRP laminates reinforced with Z-pins. A Pre-Hole Z-pinning (PHZ) process is developed to reduce the in-plane damage of the Z-pinned laminates. The microstructural observation of the Z-pinned laminate specimens indicates that the PHZ process can effectively decrease the defects including the Z-pin offset angle and the area of eyelet zone. The influences of the volume fraction and diameter of Z-pin on the fracture toughness and the delamination crack growth rate of the specimens under End Notch Flexure (ENF) loading are then determined experimentally. The test results show that Z-pin increases the interlayer stiffness of the laminate. The delamination crack growth rate is reduced with the increase of Z-pin diameter and volume fraction, and a reduction up to 40% is achieved compared with the specimens without pins. Furthermore, the Mode II fracture toughness is significantly improved with the increase of Z-pin volume fraction. When Z-pin volume fraction increases by 1%, the achieved fracture toughness is about 200% higher compared to the unpinned laminates.     

无人机复合材料壁板Z-pin工艺技术研究

介绍了Z-pin在无人复合材料壁板中的应用及复合材料Z-pin的拉挤工艺,利用热压罐和真空袋压整体Z-pin嵌入工艺,在无人机复合材料层板、板筋结构件、复合材料胶接连接件及泡沫夹层中的应用。对于板件在保持面内抗拉强度的同时,提高无人机复合材料壁板的层间断裂韧性及损伤容限,有效改善了复合材料蒙皮的抗冲击性能。     

Experimental study of partially-cured Z-pins reinforced foam core composites：K-Cor sandwich structures

This paper presents an experimental study of a novel K-Cor sandwich structure rein- forced with partially-cured Z-pins. The influence of pultrusion processing parameters on Z-pins characteristics was studied and the effect of Z-pins on mechanical properties was disclosed. Differential scanning calorimetry （DSC） and optical microscopy （OM） methods were employed to determine the curing degree of as-prepared Z-pins and observe the implanted Z-pins in the K-Cor structure. These partially-cured Z-pins were treated with a stronger bonding link between face sheets and the foam core by means of a hot-press process, thereby decreasing burrs and cracking defects when the Z-pins were implanted into the Rohacell foam core. The results of the out-of-plane tensile tests and the climbing drum peel （CDP） tests showed that K-Cor structures exhibited superior mechanical performance as compared to X-Cor and blank foam core. The observed results of failure modes revealed that an effective bonding link between the foam core and face sheets that was provided from partially-cured Z-pins contributed to the enhanced mechan- ical performances of K-Cor sandwich structures.     

Z-pins对2D编织陶瓷基复合材料搭接接头连接性能的影响

对Z-pins增强2-D编织陶瓷基复合材料搭接接头在单向载荷作用下的连接性能进行了试验研究.试验结果表明Z-pins的加入能够改善2-D编织陶瓷基复合材料搭接接头的连接件能,反映在载荷-位移曲线的后半段,载荷变化出现了波动不大的起伏区域.产生此区域的原因为Z-pins从搭接接头拔出的过程中,与复合材料形成桥联,消耗了部分本该作用在开裂尖端的能量.利用有限元的方法模拟了有、无Z-pins,Z-pins在不同直径和间距下搭接接头的失效过程,并与试验结果相比较,吻合较好.     

Z-pin植入密度对复合材料壁板力学性能影响的研究

针对植入Z-pin后的碳纤维增强平纹机织复合材料的微观结构,建立了含Z-pin的机织复合材料单层板和层合板的单胞模型。预报了Z-pin直径、面内分布密对单层板的面内纵向拉伸力学性能的影响,得出了含有Z-pin的机织复合材料单胞在受面内拉伸时,会在Z-pin附近出现应力集中,单胞首先会在应力集中区域发生失效而导致强度降低。通过三维单胞模型模拟了Z-pin在层合板中拉出脱离过程,得出了不同Z-pin直径、不同分离层厚度下的拉拔力—位移曲线。建立了用非线性弹簧模拟Z-pin的双悬臂梁模型,结合VCCT裂纹扩展技术,模拟了含有Z-pin复合材料层合板的Ⅰ型裂纹扩展,得出了Z-pin直径越大,分布越密,层合板的等效Ⅰ型应变能量释放率GIC越大,且直径越大使GIC随裂纹扩展的波动幅度越大,分布越密使GIC波动的波长越小。