梯度硅铝管壳回流焊接快速冷却热力仿真研究

针对某航天电子管壳焊接组件冷却过程中的热力耦合影响问题,建立了焊接组件的有限元热分析模型,研究了在快速冷却过程中梯度材料分布对低温共烧陶瓷(low temperature co-fired ceramic, LTCC)基板、梯度管壳的残余应力和变形的影响。以不超过基板断裂强度为前提条件,以降低管壳整体的残余应力与变形为优化目标,采用了多因素变换优选法,确定了管壳材料的最优梯度分布方案,即合金管壳自上而下的梯度分布为Al-35Si、Al-42Si、Al-50Si、Al-60Si、Al-70Si。其中,Al-35Si厚度为2.5mm, Al-42Si与Al-60Si的厚度均为1.6mm, Al-50Si厚度为0.8mm, Al-70Si厚度为2mm。在该方案下,LTCC基板冷却至室温时的最大变形量为4.86μm,最大第一主应力为6.761MPa,远小于LTCC材料的断裂强度320MPa;管壳冷却至室温时的最大变形量为18.291μm,最大残余应力值为20.46MPa,远小于管壳材料的屈服强度100MPa。管壳各层之间的应力集中现象不明显,管壳的整体焊接质量得到提升。     

Dynamic Analysis of Contact Bounce of Aerospace Relay Based on Finite Difference Method

Contact bounce of relay, which is the main cause of electric abrasion and material erosion, is inevitable. By using the mode expansion form, the dynamic behavior of two different reed systems for aerospace relays is analyzed. The dynamic model uses Euler-Bernoulli beam theory for cantilever beam, in which the driving force (or driving moment) of the electromagnetic system is taken into account, and the contact force between moving contact and stationary contact is simulated by the Kelvin-Voigt viscoelastic contact model. Analytical results have been complemented by the finite difference calculation of the nonlinear partial differential equations of reed system. The calculation results indicate that with the driving force (or driving moment) being increased, the closing time of contact is decreased, but the maximum bouncing displacement and bouncing time tend to be decreased first and then increased, which means that there are minimum values of maximum bouncing displacement and bouncing time. The closing time of contact, the maximum bouncing displacement, and bouncing time all tend to be decreasing with the pushrod being approaching the contact. The model can be used as design tool to improve relay performance and reduce contact bounce.     

Cyclic Oxidation Behavior of an EB-PVD CoCrAlY Coating Influenced by Substrate/coating Interdiffusion

To reveal the influence of substrate/coating interdiffusion on the cyclic oxidation property of a metallic coating, cyclic oxidation behavior of an EB-PVD CoCrAlY coating on directionally solidified Ni-based superalloy DZ125 at 1 050 oC is investigated. The 40 μm thick CoCrAlY coating has a cyclic oxidation life of around 160 h, and the oxidation constant is 1.915× 10.7 mg4·cm.8·s.1. However, severe spallation of the oxides containing Co, Cr, Ni, Ta and Ti occurs with longer cyclic oxidation. The degradation in oxidation resistance for the coating is related to the depletion of Al due to the oxide spallation and interdiffusion. Severe interdiffusion between the coating and underlying substrate occurs at 1 050 oC. The composition of the substrate has an important effect on the thermal cycling lifetime of the coating. The influencing mechanism is discussed.     

CCD衬底反弹防护的工程实现

文章阐述了电荷耦合器件（CCD）衬底反弹问题产生的机理以及防护措施。针对高速驱动信号的工作特点和衬底反弹对CCD信号造成的影响,介绍并分析了波形化理论。理论分析表明,利用波形化理论能够对衬底反弹进行抑制,通过电路仿真和实际电路测试,验证了理论分析的正确性,为焦面驱动电路设计提供了一种新方法。     

基于振动试验的基板刚度测试

为获取太阳电池阵基板性能,通常在基板生产过程中同步制作随炉件,采用三点弯曲法测试随炉件刚度,进而间接判断基板的性能。但是由于外界因素的影响,该测试结果难以反映基板的真实刚度。文章提出采用单板振动试验测试基板弯曲刚度,并针对某型号太阳电池阵基板完成了测试。测试结果表明:基板实际刚度与数值分析结果仅相差2.2%;与三点弯曲法测试结果相比,振动试验测试结果可以更准确反映基板真实性能。     

耐150 ℃太阳翼基板结构胶黏剂性能研究

介绍了一种J-159结构胶黏剂,用于太阳翼基板结构的板-芯胶接,重点进行了胶黏剂的力学性能、真空挥发性能、耐辐照性能研究,同时开展了典型件的制备及热真空循环试验。结果表明,J-159胶黏剂在150℃下各项力学性能保持率均56%,远高于常用的J-47胶黏剂,具有很好的耐高温性能。同时,真空挥发性能和耐带电粒子辐照性能满足航天器空间应用要求,制备的典型件在-105～+150℃热真空循环试验后,外观质量、胶接质量及其他性能均符合指标要求,能够满足卫星太阳翼基板耐150℃及以下空间环境的使用需求。     

氮化铝颗粒增强聚合物基板材料的制备及介电性能研究

采用氮化铝(AlN)颗粒作为增强材料,以环氧树脂(E-51)为聚合物基体,制备了陶瓷颗粒/聚合物复合电子封装与基板材料.对该复合材料的成型工艺、介电性能和导热性能进行了系统的研究.随着陶瓷颗粒增强材料含量的增加,复合材料的导热性能得到改善.在加入了陶瓷颗粒增加了复合材料导热性的同时,仍维持了聚合物材料低介电常数的优点.     

基于微型压力传感器阵列的边界层分离点检测方法

为了检测边界层的分离点,探讨了根据表面压力分布变化判定分离点的检测方法,提出了基于微机电系统(MEMS)技术和柔性衬底的微型压力传感器阵列的结构方案,可实现在线实时测量,并满足非平面表面的流体测量要求;同时提出了1种分离点检测的判定方法,并通过二维圆柱绕流仿真验证了该方法的正确性和有效性。微型压力传感器阵列的引入,拓宽了边界层分离点检测的解决途径。     

双热流计稳态法材料导热性能测试装置与分析

在分析多层平板一维稳态热传导过程的基础上,确定了双热流计结构一维稳态热传导的物理模型和实现一维稳态热传导的技术条件,设计制作了一套可用于材料导热性能测试的双热流计实验装置。采用C 编制了可运行于Windows环境下的测试和数据处理软件,利用导热系数已知的三组试样:石英玻璃、聚苯乙烯、含碳0.45%钢在所研制的实验装置上进行了导热系数测试分析。实验结果表明,对于导热系数介于1~10 W/mK的材料,测试结果与文献报道数值吻合得很好。测试结果的重复性也比较好。可以满足实际工程导热系数测量的需要。     

高速数字电路中的信号完整性问题

主要介绍了在高速数字电路中的信号完整性问题。并讨论了如何降低电路中信号干扰的方法。