Al合金与复合材料LID连接接头微观结构分析

通过SiC颗粒增强Al基复合材料与Al合金的液相界面扩散 (LID)连接试验 ,重点研究了连接接头区域的微观组织 ,并简要分析了接头中各元素的浓度分布情况。结果表明 ,LID连接Al基复合材料和Al合金形成的界面明显向Al合金一侧偏移 ,并且溶质原子在界面两侧分布存在明显的不对称现象。研究结果为异种材料的连接提供了重要的科学依据     

间隙连接对胶接接头应力分布和强度的影响

运用弹塑性有限元法结合实验研究了连续和间隙连接的单搭接接头应力分布规律，并考虑了胶瘤的影响。结果表明，在相当大间隙长度范围内和适当的间隙位置条件下，间隙连接接头并没有大幅度地减小其承载能力，相反其有效搭接区域剪切强度呈明显升高趋势；胶层应力峰值仍然发生在搭接末端；胶瘤承担了相当大的载荷作用；过大的间隙长度以及不当的间隙位置会导致胶层靠近间隙端应力集中明显加剧，成为新的高应力区，可能导致接头破坏模式的改变。实验结果与数值分析结果很好地吻合。     

弱界面黏结通用单胞模型数值分析

为考查通用单胞模型和弱界面分离模型模拟复合材料界面脱黏的有效性,考虑了柔性界面,常响应界面和渐进适应界面三种不同的界面分离模型,并分析了界面对材料性能的影响.计算结果表明,将界面分离模型集成到通用单胞模型中,增强了通用单胞模型的适用范围和对复合材料力学响应特性的模拟分析能力.      

Fabrication of Ti/Al/Mg laminated composites by hot roll bonding and their microstructures and mechanical properties

Ti/Al/Mg laminated composites were successfully fabricated by hot roll bonding. The effects of the rolling reduction on the microstructural evolution and mechanical properties of the composites were explored. The results show that Ti/Al/Mg laminated sheets exhibit good interfacial bonding. The rolling reduction has a significant effect on the deformation inhomogeneity through the thickness of the Al layer. The initial grains of the Al layer near the Ti/Al interface are fragmented into fine equiaxed grains, and the grains at the center and near the Al/Mg interface are elongated. The R-cube shear texture of the Al layer forms near the Ti/Al interface and permeates into the center layer in the samples with greater rolling reductions. The β-fiber rolling texture of the Al layer is observed near the Al/Mg interface and increases with the increase of rolling reduction. The stress–strain curves indicate that the fracture appears first in the Mg layer. With the increasing rolling reduction, the ultimate tensile and yield strength values increase, and the elongation up to the Mg layer fracture decreases.     

Microstructural formation and mechanical performance of friction stir double-riveting welded Al-Cu joints

A novel friction stir double-riveting welding (FSDRW) technology was proposed in order to realize the high-quality joining of upper aluminum (Al) and lower copper (Cu) plates, and this technology employed a Cu column as a rivet and a specially designed welding tool with a large concave-angle shoulder. The formations, interfacial characteristics, mechanical properties and fracture features of Al/Cu FSDRW joints under different rotational velocities and dwell times were investigated. The results showed that the well-formed FSDRW joint was successfully obtained. The cylindrical Cu column was transformed into a double riveting heads structure with a Cu anchor at the top and an Al anchor at the bottom, thereby providing an excellent mechanical interlocking. The defect-free Cu/Cu interface was formed at the lap interface due to the sufficient metallurgical bonding between the Cu column and the Cu plate, thereby effectively inhibiting the propagation of crack from the intermetallic compound layer at the lap interface between the Al and Cu plates. The tensile shear load of joint was increased first and then decreased when the rotational velocity and dwell time of welding tool increased, and the maximum value was 5.52 kN. The FSDRW joint presented a mixed mode of ductile and brittle fractures.     

Recent advances and trends in roll bonding process and bonding model: A review

This review presents a thorough survey of the roll bonding process with a focus on the bimetallic bars/tubes as well as the bonding models and criteria. The review aims to provide insight into cold, hot and cryogenic bonding mechanisms at the micro and atomic scale and act as a guide for researchers working on roll bonding, other joining processes and bonding simulation. Meanwhile, the shortcomings of roll bonding processes are presented from the aspect of formable shapes, while bonding models are shown from the aspect of calculation time, convergence, interface behavior of dissimilar materials as well as hot bonding status prediction. Two well-accepted numerical methodologies of bonding models, namely the contact algorithm and cohesive zone model (CZM) of bonding models and in simulations of the bonding process are highlighted. Particularly, recent advances and trends in the application of the combination of mechanical interlocking and metallurgical bonding, special energy fields, gradient structure, novel materials, green technology and soft computing method in the roll bonding process are also discussed. The challenges for advancing and prospects of the roll bonding process and bonding model are presented in an attempt to shed some light on the future research direction.     

Hot deformation behavior and strain compensation constitutive model of equiaxed fine grain diffusion-welded micro-duplex TC4 titanium alloy

In this work, two-stage diffusion bonding of micro-duplex TC4 titanium alloy was carried out to study the flow behavior and constitutive models of the bonding joint and the base metal after the same thermal cycling during the hot forming process. Microstructure and mechanical properties test were used to verify the good quality of the equiaxed fine grain diffusion-welded TC4 alloy. Quasi-static tensile experiment was carried out at temperatures ranging from 750–900 °C and strain rates of 0.0001–0.1 s⁻¹. The joint showed the weak dynamic recovery at strain rates of 0.01–0.1 s⁻¹ and temperatures of 750–850 °C. At strain rates of 0.0001–0.001 s⁻¹ and temperatures of 850–900 °C, the flow stress of joint presented steady-state characteristics. Different deformation conditions lead to the remarkable difference of dynamic softening performance between the joint and heat-treated base metal, but the flow stress in elastic and strain hardening stages exhibited similar behavior. The strain compensated Arrhenius-type constitutive models of TC4 joint and heat-treated base metal were developed respectively. The fifth-order polynomial functions between the material property correlation coefficients and strain were obtained. The models have shown good correlation, with correlation coefficient values of 0.984 and 0.99. The percentage average absolute relative error for the models were found to be 10% and 9.46%, respectively.