切削工具材料的发展综述

具体介绍切削工具材料如高速钢、硬质合金、陶瓷、金属陶瓷、刀具涂层技术、超硬材料的演变和进展。     

硬质合金电火花加工工艺实验研究

针对硬质合金模具的加工表面精度要求,进行了高速钢与硬质合金两种材料的电火花加工工艺对照实验。为获得较低的表面粗糙度,选取了较小的电加工参数。实验结果表明,在该实验条件下,电火花加工的表面粗糙度不再满足常规条件下的经验公式,而与工件材料的再凝结特征、成分及电蚀产物的排出条件有关。     

类芬顿反应在碳化硅光学材料研抛中的作用

本文讨论了以零价铁代替亚铁盐形成类芬顿反应(Fenton-Kind process)体系应用于碳化硅光学材料抛光过程中的反应机理,通过双转子研抛机床对SiC光学材料进行了研抛实验,验证了类芬顿反应能够有效地提高SiC材料的加工效率和加工质量。通过对比不同磨料粒度研抛液加工结果,获得了SiC材料研抛过程中化学与机械作用规律。     

DLC涂层硬质合金微钻的制备及其切削性能

在硬质合金微型刀具加工高硅铝合金等难加工材料时,通过采用改进的热丝CVD装置开展了DLC涂层硬质合金微钻制备工艺优化,得到了最优沉积工艺,并配合高速加工高硅铝合金(Si15%)材料微小孔钻削性能对比试验,分析了刀具的磨损机理.结果表明:两步预处理方法适合复杂形状硬质合金衬底的预处理方法.钻削高硅铝合金时,DLC涂层具有低摩擦系数和高耐磨损特性,同等切削条件下,涂层微钻的切削寿命比未涂层硬质合金微钻提高了10倍.     

高速钻削复合材料的切削力

采用多种硬质合金钻头,在高转速和不同进给速度条件下对碳纤维/环氧树脂复合材料进行孔加工正交试验,通过研究其轴向力和扭矩以分析刀具条件和切削参数的适应性.结果表明:主轴转速是影响轴向力和扭矩的最主要因素,高转速钻削时轴向力和扭矩都显著减小;减小进给速度也使轴向力和扭矩减小,但其影响小于主轴转速.此外,钻头材质对轴向力和扭矩的影响大于钻头几何形状和进给速度;进给速度对轴向力的影响较大,而钻头几何形状对扭矩的影响较大.     

Laser-induced oxidation assisted micro milling of high aspect ratio microgroove on WC-Co cemented carbide

Severe tool wear and poor surface quality are the main problems during micro machining of cemented carbide. In this work, an innovative hybrid process of laser-induced oxidation assisted micro milling (LOMM) was proposed to solve the problems. A nanosecond laser was utilized to induce oxidation of the WC-20%Co material, producing loose oxide which was easy to remove. The micro machinability of the material was improved by laser-induced oxidation. The oxidation mechanisms of cemented carbide were studied. A microgroove with a depth of 2.5 mm and aspect ratio of 5 was fabricated successfully. The milling force, surface quality and tool wear mechanisms were investigated. For comparison, a microgroove was also fabricated with conventional micro milling (COMM) using identical milling parameters. Results revealed that in LOMM the milling force and tool wear rate were extremely low during removing the oxide. The machined surface quality and dimensional accuracy achieved by LOMM were superior to those obtained by COMM. The surface roughness S_a of the microgroove bottom reached 88 nm in LOMM, while the cross-sectional geometry of the microgroove was a trapezoid. Perpendicularity of the microgroove sidewall machined by LOMM was better than that by COMM. The tool wear forms in LOMM were coating spalling and slight tool nose breakage. Compared with COMM, the tool life in LOMM was prolonged significantly. It indicates that the proposed hybrid process is an effective and efficient way to fabricate high aspect ratio micro-features with high dimensional accuracy.     

基于激光旋切法的陶瓷材料盲孔加工方法研究

介绍了激光打孔的基本原理,对激光能量、离焦量、轨迹在激光旋切法加工盲孔过程中对孔形和表面质量的影响进行了分析和试验验证,并给出了一般规律.依据试验结果确定了合理工艺参数,采用旋切法在碳纤维增强碳化硅陶瓷基复合材料（Cf/SiC）上打出了孔径为1 mm,孔深为1.1 mm,锥度小于15°的盲孔.     

Cr12V与Cr12MoV钢的接触疲劳性能研究

对Cr12V与Cr12MoV钢的接触疲劳性能进行了对比试验研究。结果表明,Cr12V钢比Cr12MoV钢有较高的接触疲劳寿命,额定寿命L10是Cr12MoV钢的2.11倍,中值寿命L50是Cr12MoV钢的1.62倍。分析认为,Cr12V钢与Cr12MoV钢相比,具有较高的硬度、较小的碳化物尺寸以及较高的V含量,这是Cr12V钢接触疲劳寿命高的原因。     

SiC MOSFET短路特性

为确保碳化硅(SiC)功率器件在过载、短路等工况下能安全可靠地工作,必须充分认识SiC器件的短路机理。首先对SiC MOSFET硬开关短路故障下短路电流原理进行了分析,在此基础上对不同电路参数对SiC MOSFET短路特性的影响进行了对比分析,揭示了短路特性的关键影响因素,并对Si与SiC MOSFET短路能力和器件恶化机理进行了对比分析,从而为设计SiC MOSFET短路保护电路提供一定的指导。     

用于热真空环境下整星微波无线测试的低PIM吸波热沉研制

随着通信卫星技术的发展,收发共用已成为通信卫星有效载荷常用的设计方法,在这种情况下,无源互调(passive intermodulation,PIM)问题就显得尤为突出。为了完成整星及转发器分系统在热真空环境下的PIM指标测试,利用碳化硅吸波材料研制了一种低PIM吸波热沉,并利用该吸波热沉建立了指标小于150 dBm的低PIM测试环境,同时兼具热流模拟功能和微波功率耐受能力。在热真空环境下圆满完成了国内首次有整星参与的微波载荷无线PIM测试试验。