Electrochemical trepanning with uniform electrolyte flow around the entire blade profile

In the traditional machining process for diffusers, blades are easily deformed, and methods suffer from high tool wear and low efficiency. Electrochemical machining(ECM) possesses unique advantages when applied to these difficult-to-machine materials. In the ECM process, theflow field plays a crucial role. Here, an electrolyte flow mode that supplies uniform flow around the entire blade profile was adopted for electrochemical trepanning of diffusers. Various flow rates were employed to obtain the optimal flow field. Simulations were conducted using ANSYS software, and results indicated that increasing the flow rate substantially afforded a more uniform flowfield. A series of experiments was then performed, and results revealed that increasing the flow rate greatly improved both the machining efficiency and the surface quality of the diffusers. The maximum feeding rate of the cathode reached 4 mm/min, the blade taper of the concave part decreased to 0.02, and the blade roughness was reduced to 1.216 lm. The results of this study demonstrated the high feasibility of this method and its potential for machining other complex components for engineering applications.     

Machining of a film-cooling hole in a single-crystal superalloy by high-speed electrochemical discharge drilling

Single-crystal superalloys are typical advanced materials used for manufacturing aeroengine turbine blades. Their unique characteristics of high hardness and strength make them exceedingly difficult to machine. However, a key structure of a turbine blade, the film-cooling hole,needs to be machined in a single-crystal superalloy; such machining is challenging, especially considering the increasing levels of machining efficiency and quality demanded by the aeroengine industry. Tube electrode high-speed electrochemical discharge drilling(TSECDD), a hybrid technique of high-speed electrical discharge drilling and electrochemical machining, provides high machining efficiency and accuracy, as well as eliminating the recast layer. In this study, TSECDD is used to machine a film-cooling hole in a nickel-based single-crystal superalloy(DD6). The Taguchi methods of experiment are used to optimise the machining parameters. Experimental results show that TSECDD can effectively drill the film-cooling hole; the optimum parameters that give the best performance are as follows: pulse duration: 12 ls, pulse interval: 30 ls, peak current:6 A, and salt solution conductivity: 3 m S/cm. Finally, a hole is machined by TSECDD, and the results are compared with those obtained by electrical discharge machining. TSECDD is found to be promising for improving the surface quality and eliminating the recast layer.     

铝阳极在KOH甲醇-乙醇体系中的电化学性能

为了提高铝的活化性能以及降低铝的腐蚀,用电化学方法研究了在碱性甲醇-乙醇有机体系中,添加剂H2O对铝阳极(99.999%)电化学行为的影响。结果表明:4 mol/L KOH+甲醇-乙醇(5∶5)+30%H2O体系能大幅度抑制铝腐蚀,缓蚀率高达70.04%,但极化程度有所增大。在-1.20 V处,铝的电流密度高达72.66 mA/cm2;开路电位Eocp负移程度最大(-1.933 V)。     

浮法抛光在金属纳米级超光滑表面加工中的应用

介绍了浮法抛光的机械结构与抛光原理,并采用这种技术在CJY500超精密研磨机上进行长方形GCr15轴承钢工件超光滑表面的工艺试验,成功获得了无加工变质层的金属纳米级超光滑表面,拓展了浮法抛光技术的应用范围,对于金属工件纳米级超光滑表面的加工具有参考价值.     

散粒磨粒抛光运动轨迹的仿真与合理参数的选择

通过计算机模拟出磨粒的运动轨迹,从而得出影响抛光质量的因素,并提出了合理的抛光运动参数。     

IC制造中平坦化技术的性能与分析

表面平整化技术是半导体工业的关键技术,在一定程度上制约着半导体芯片集成技术的发展,针对多层立体布线的IC全局平坦化技术,介绍了代表当今平整化技术及其未来的发展方向,其中一些技术会取代传统的CMP技术而成为IC产业的主导技术之一;叙述了超大规模集成电路(ULSI)的发展对全局平整化的具体要求;对传统的CMP技术的特点进行了分析;并论述了当今主流的IC平整化技术的原理、性能以及未来的发展方向。     

大扭曲叶片整体涡轮电解加工工艺研究

研究用展成电解工艺进行大扭曲度整体涡轮叶片的机械加工，对涡轮叶片型面进行数据处理，用软件方式实现电解加工的多轴联动进给；分析叶片电解过程成形规律，合理设计阴极、流场，解决大扭曲叶片加工的叶背二次腐蚀、出口短路等关键工艺问题，试验可稳定达到工序精度要求，并可批量生产。     

带冠整体叶轮通道加工方法的分析和探索

讨论了整体叶轮应用于现代发动机的发展趋势及其制造难点。在分析现有加工工艺的基础上,提出了适用于带冠整体叶轮叶片型面的新型加工方法——电解加工与电火花加工的组合工艺。     

数控电解加工整体叶轮的关键技术

以平行直纹型面的数控展成电解加工为例，对数控电解加工整体叶轮的主要关键技术，包括成形规律、展成运动、数控编程、阴极设计制造、机库及多轴联动数控系统、典型叶轮加工工艺逐一进行了介绍。     

30CrMnSiNi2A 双头螺栓断裂失效分析

分离装置静力试验后发现连接两个舱体的双头螺栓中有7 件发生断裂,螺栓表面进行了达克罗

处理。通过失效分析及相关试验综合分析认为,分离装置上7 件螺栓的断裂性质均为延迟性脆性断裂,断裂机

理为氢脆。导致发生氢脆断裂的原因除螺栓材料及组织具有较高的氢脆敏感性外,主要与静力试验过程中长

时间包覆湿泥有关;另外,原材料氢含量控制及达克罗涂层工艺处理虽然有效避免了产品表面处理过程中带来

的氢脆隐患,但是若使用环境中存在水及腐蚀性介质Cl、S 时,产品在拉应力作用下仍可能发生氢脆延迟断裂

而导致严重后果。