Prediction of cutting forces in flank milling of parts with non-developable ruled surfaces

Predicting the cutting forces required for five-axis flank milling is a challenging task due to the difficulties involved in determining the Undeformed Chip Thickness(UCT) and CutterWorkpiece Engagement(CWE). To solve these problems, this paper presents a new mechanistic cutting force model based on the geometrical analysis of a flank milling process. In the model,the part feature and corresponding cutting location data are taken as input information. The UCT considering cutter runout is calculated according to the instantaneous feed rate of the element cutting edges. A solid-discrete-based method is used to precisely and efficiently identify the CWE between the end mill and the surface being machined. Then, after calibrating the specific force coef-ficients, the mechanistic milling force can be obtained. During the validation process, two practical operations, three-axis flank milling of a vertical surface and five-axis flank milling of a nondevelopable ruled surface, are conducted. Comparisons between predicted and measured cutting forces demonstrate the reliability of the proposed cutting force model.     

表面组装技术和片状元件在空间应用的可能性

文章简单介绍了表面组装技术和片状元件的概况;结合卫星的特点,阐明了表面组装技术和片状元件在空间电子设备中应用的必要性和可能性。     

Cutting force prediction for circular end milling process

A deduced cutting force prediction model for circular end milling process is presented in this paper. Traditional researches on cutting force model usually focus on linear milling process which does not meet other cutting conditions, especially for circular milling process. This paper presents an improved cutting force model for circular end milling process based on the typical linear milling force model. The curvature effects of tool path on chip thickness as well as entry and exit angles are analyzed, and the cutting force model of linear milling process is then corrected to fit circular end milling processes. Instantaneous cutting forces during circular end milling process are predicted according to the proposed model. The deduced cutting force model can be used for both linear and circular end milling processes. Finally, circular end milling experiments with constant and variable radial depth were carried out to verify the availability of the proposed method. Experiment results show that measured results and simulated results corresponds well with each other.     

数字采集虚拟频率测试系统的设计与实现

利用Visual Basic串口通信技术使单片机与计算机相连接，并且在visual Basic环境下编写数字采集虚拟频率测试系统的程序，实现对数字量信号多种参数的采集、传送、实时测量及显示（频率、周期、脉冲宽度，占空比以及TTL电平采集等）。结果表明，设计具有较准确的测量能力和广泛的实用性，系统成功实现了局域网络远程测量，界面友好。     

实用集成芯片逻辑功能测试仪

本文介绍了一种用Ｚ８０－ＣＰＵ组成的基本逻辑电路集成芯片测试仪的原理和方法。     

基于NiosII的SoPC系统在时统系统中的应用开发

N iosII处理器是一种用户可随时配置和构建的32位指令集和数据通道的嵌入式系统微处理器IP核,与传统的8/16位系统相比,无论处理器的结构还是开发手段上都发生了较大变化。本文主要介绍了N iosII的性能特点和基于N iosII的SoPC系统的功能构架,给出了基于N iosII处理器的SoPC系统在时统系统中的一种应用方案。其中重点介绍了该方案的SoPC系统设计实现和软件设计实现。     

一种芯片原子钟专用锁相倍频器研究与设计实现

分析了倍频器对芯片原子钟稳定度指标的影响,并以此提出了对倍频器的设计要求。介绍了国内外几种典型的原子钟倍频器,提出了一种基于撞-D调制的芯片原子钟专用锁相倍频器方案,并采用分离器件对该方案进行了验证,实现了与传统铷钟物理系统的闭环锁定,铷原子频标稳定度指标达4.7E-12/s,能满足原子钟的研制需求。基于该方案开展了倍频器芯片的设计和流片,实现了3.4GHz的芯片原子钟专用芯片,与物理系统进行联调锁定后稳定度指标达5.5E-11/s,表明该芯片可满足芯片原子钟的设计要求。     

ELID成形磨削实验研究与表面粗糙度预测

为了探究ELID成型磨削中磨削参数和电解参数对表面粗糙度的影响规律,基于未变形切屑厚度模型,考虑砂轮上磨粒出刃高度的随机性以及ELID磨削中氧化膜的影响,建立了针对ELID磨削的表面粗糙度预测模型。单因素实验研究了ELID成形磨削电源参数对表面粗糙度的影响规律,并探讨了电解电流与氧化膜厚度之间的关系。全因子实验以工件转速、砂轮转速和进给切深为影响因素,研究了磨削参数对表面粗糙度的影响规律,并对预测模型进行了验证。结果表明:磨削参数中,其他条件一定时,表面粗糙度随砂轮转速的增大而减小,随工件转速和切深的增大而增大;同时对于粗糙度的预测误差达到了8.75%,预测模型有效可靠。     

家用火灾自动报警装置的设计

城市家庭安装火灾自动报警装置非常必要。使用单片机,选用数字化温度传感器和烟雾检测器作为敏感元件,利用多传感器信息融合技术,设计适用于家庭的火灾报警装置,可使整个系统硬件电路设计合理,性能安全可靠。     

机载设备ATS程控电阻设计

程控电阻是在某机载设备自动测试系统（ATS）中应用于模拟输出具有阻值特性的模块。传统的程控电阻体积较大,精度较低且可靠性差;国外程控电阻模块精度较高但是价格昂贵,不利于大规模应用。介绍一种小型化高精度程控电阻设计方法,该程控电阻由控制器、继电器以及各阻值不等的精密电阻构成。控制器内部包括51单片机最小系统、E2PROM、485总线等集成器件。经实验,该电阻可程控完成（0~10）kW范围的阻值调节输出,电阻分辨力为2 W,可广泛应用于各种测试系统。