C_f/SiC复合材料与Ti合金的AgCuTi-W复合钎焊

本文利用AgCuTi-W复合钎料作中间层,在适当的工艺参数下真空钎焊Cf／SiC复合材料与Ti合金,利用SEM,EDS,XRD分析接头微观组织结构,利用剪切试验检测接头力学性能。研究结果表明：钎焊时,复合钎料中的Ti借助Cu-Ti液相与Cf／SiC复合材料反应,在Cf／SiC复合材料与连接层界面形成Ti3SiC2,Ti3Si和少量TiC化合物的混合反应层。复合钎料中的Cu与Ti合金中的Ti发生互扩散,在连接层与Ti合金界面形成不同成分的Cu—Ti化合物过渡层。钎焊后,形成W颗粒强化的致密复合连接层,W颗粒主要分布在Cu-Ti相中。W的加入缓解了接头的残余热应力,Cf／SiC／AgCuTi—W／TC4接头剪切强度明显高于CF／SiC／AgCuTi／TC4接头。     

TC4合金与碳纤维增强ZrB2-SiC陶瓷钎焊接头的微观结构与力学性能

文摘采用Ag-28Cu钎料对碳纤维增强ZrB_2-SiC复合陶瓷与TC4合金真空钎焊。利用扫描电子显微:镜、能谱分析仪、力学万能试验机研究钎焊保温时间对钎焊接头界面微观结构与剪切强度的影响。结果表明:碳纤维增强ZrB_2-SiC/Ag-28Cu/TC4钎焊接头结合良好,典型接头相组成如下:TC4/TiC+TiCu/Ti_2Cu/TiCu/Cu_((s,s))/Ag_((s,s))/Ti_5Si_3/TiC/ZrB_2-SiC-C。不同的保温时间未改变钎焊接头的相组成,但对于接头界面微观形貌、焊·缝厚度及组成相的数量有影响。随钎焊保温时间增加,焊缝中心Ag(s,s)、Cu(s,s)区域逐渐减小,近TC4侧反应中Ti-Cu反应层厚度逐渐增加,其中保温30 min焊缝厚度最厚为70μm、焊缝中心区域厚度为45μm。室温平均剪切强度随保温时间增加,先增加后降低,在保温时间20 min时,剪切强度最大为34 MPa。     

钎焊温度对Ti60/AgCu/ZrO_2接头界面组织及性能的影响

采用AgCu钎料实现了Ti60合金和ZrO_2陶瓷的钎焊连接。使用扫描电子显微镜(Scanning Electron Microscope,SEM)、能谱仪(Energy Dispersive Spectrometer,EDS)和X射线衍射仪(X-Ray Diffractometer,XRD)等分析测试手段,对不同钎焊温度下获得的接头界面组织结构进行了分析。研究表明,Ti60/AgCu/ZrO_2接头典型界面组织为:Ti60合金/α-Ti+Ti_2Cu扩散层/TiCu+TiCu_2/Ag(s,s)+Cu(s,s)/Ti_3Cu_3O反应层/TiO反应层/ZrO_2陶瓷。随着钎焊温度的升高,α-Ti+Ti2Cu扩散层、TiCu+TiCu_2层、Ti3_Cu_3O层及TiO层厚度均逐渐增加,颗粒状Ti-Cu化合物不断长大,Ag(s,s)和Cu(s,s)含量逐渐减少。剪切试验表明,在钎焊温度为900℃、保温时间为10min条件下获得的接头室温抗剪强度最高为124.9 MPa,500℃和600℃抗剪强度分别为83.0 MPa和30.2 MPa。断口分析表明:接头沿ZrO_2陶瓷/钎料界面和靠近该界面的钎缝发生断裂。     

结合钎焊和氩弧焊方法对钛合金/Nb/不锈钢接头的连接

利用AgCu-1.8Ti和AgCu-4.4Ti两种钎料对Nb与0Cr17N i4Cu4Nb不锈钢进行润湿性研究,并钎焊Nb与0Cr17N i4Cu4Nb接头。AgCu-1.8Ti在Nb与0Cr17N i4Cu4Nb上的润湿角均小于AgCu-4.4Ti。分析接头组织发现,AgCu-4.4Ti钎料接头中在靠近不锈钢侧存在约50μm宽的富Ti层,而AgCu-1.8Ti钎料接头中未发现该富Ti层。利用氩弧焊将TC4与Nb预先焊好后再用两种钎料钎焊Nb和不锈钢,测定TC4/Nb/0Cr17N i4Cu4Nb接头的室温拉伸强度。数据显示,AgCu-1.8Ti钎料接头的室温拉伸强度平均值达到222.2MPa,而AgCu-4.4Ti钎料接头强度仅有133.8MPa,所有接头均断于Nb与0Cr17N i4Cu4Nb界面。     

Zn-Al-Si钎料钎焊铜/铝接头显微组织及性能研究

采用Zn-14.1Al-0.9Si和Zn-21.5Al-1.5Si两种钎料钎焊获得铜/铝接头,研究了Cu/Zn-Al-Si/Al接头Cu母材/钎缝界面结构、钎缝中心区显微组织、接头抗剪切性能和断口形貌.研究发现,Cu/Zn-14.1Al-0.9Si/Al接头和Cu/Zn-21.5Al-1.5Si/Al接头界面结构均为Cu/扩散层/Al4.2Cu3.2Zn0.7,其中Al4.2Cu3.2Zn0.7化合物层厚度分别为1～2 μm和3～4μm.2种铜/铝接头钎缝中心区均由α-Al固溶体,η-Zn固溶体,Zn-Al共晶和Si单质组成,未发现脆性CuAl2化合物.由于具有较薄的界面化合物层,在剪切力作用下,Cu/Zn-14.1Al-0.9Si/Al接头断裂一部分起源于Al4.2Cu3.2Zn0.7化合物层,另部分起源于界面扩散层,而Cu/Zn-21.5Al-1.5Si/Al接头断裂均起源于较厚的Al4.2Cu3.2Zn0.7化合物层.因此,Cu/Zn-14.1Al-0.9Si/Al接头的抗剪切强度高于Cu/Zn-21.5Al-1.5Si/Al接头,分别为60.1MPa和55.6MPa.     

界面端奇异应力场分析在异种材料焊接中的应用

依据界面力学的奇异性理论,阐述了接触角为90°的对接界面的奇异应力场特征,并以此为基础,分别对异种钛合金的线性摩擦焊材料选用、Cf/C复合材料与TC4钛合金钎焊接头的钎料选择及界面层设计进行了分析,结果表明:TC4/TC17较TC11/TC17具有较好的界面匹配,更易获得良好的线性摩擦焊接头;选用AgCuTi钎料较TiZrNiCu钎料更适于Cf/C复合材料与TC4合金的钎焊;选用TiZrNiCu钎料时,采用Cf/C复合材料/TiZrNiCu/Cu/TiZrNiCu/Mo/TiZrNiCu/TC4界面结构进行钎焊可获得较好的匹配连接。     

TiAl合金与42CrMo扩散钎焊的界面组织及形成机理

使用真空扩散钎焊方法对870℃下TiAl/B-Ag72Cu/42CrMo进行了连接,利用金相显微镜、扫描电镜、电子探针成分线分析及成分定量分析等方法研究了TiAl/B-Ag72Cu/42CrMo扩散钎焊接头组织及接头反应层的形成机理.界面分析显示,B-Ag72Cu/42CrMo的界面未形成金属间化合物,而TiAl/B-Ag72Cu的界面上有Ti(Cu,Al)2金属间化合物产生.分析了连接接头金属间化合物的形成和长大机制,钎焊接头金属间化合物的形成和长大机制,分为等温凝固和冷却凝固两个阶段.元素的扩散是控制接头形成的主要因素.连接界面金属间化合物的形成和长大主要有钎料的熔化、沿晶界优先扩散、等温凝固、柱状和蘑菇状长大及纵向长大几个过程.     

TC1钛合金蜂窝夹层结构的钎焊工艺研究与分析

研究了TC1钛合金蜂窝夹层结构试件的钎焊工艺,通过对系列工艺下钎焊界面组织进行观察得出,在930℃/保温15min和一定钎料添加量的条件下,界面析出了TiNi2(Cu,Zr)化合物,且尺寸细小、分布弥散,因而相应钎焊试件的室温拉脱强度平均值较高,可达17MPa。在钎焊过程中,Cu和Ni元素由钎料向母材扩散,使母材β相变温度降低,导致界面魏氏体组织的产生;芯体波纹带间受钎料熔化热影响较大,导致此处魏氏体组织粗大,成为试件的薄弱部位。     

Al2O3陶瓷与GH3536真空钎焊接头界面组织与力学性能

采用Ag-5.0Cu-1.0Al-1.25Ti银基钎料通过真空钎焊的方法实现了Al₂O₃陶瓷与镍基高温合金GH3536的连接。为明确钎焊接头的界面形成机理,通过扫描电子显微镜和X射线衍射分析的测试方法研究了接头的界面组织结构与物相组成。同时探究了钎焊温度与保温时间对接头微观组织与力学性能的影响规律,从而实现工艺参数的优化。研究表明：在钎焊温度为970℃,保温时间为10 min的条件下,Al₂O₃/GH3536钎焊接头的典型界面组织为Al₂O₃/Ti₃（Cu, Al）₃O/Ag（s, s）+AlCu₂Ti/TiNi₃+TiFe₂/GH3536,其接头的抗剪强度最高可达到194±10 MPa。随着钎焊温度的升高和保温时间的延长,Ti₃（Cu, Al）₃O反应层的厚度增加,钎缝中的富Cu相减少,AlCu     

利用金属间化合物增强陶瓷钎焊接头强度

研究了Ag-Cu-Ti/加Ti/N i/Ti复合层钎焊S i3N4陶瓷的接头组织与性能。结果表明,钎缝中形成了以金属间化合物为高熔点相和Ag-Cu作为基体的组织。对界面反应层的观察表明,反应层分为两层结构。保温时间、连接温度、Ti箔和N i箔厚度及Ag-Cu-Ti钎料厚度均能影响接头组织和强度。在本实验范围内,其它参数一定的条件下,分别在30m in,970℃,Ti箔30μm和N i箔60μm及Ag-Cu-Ti片150μm时取得了最大强度值。     

Ti和Ti／Ni／Ti连接钨与铜及其合金的界面结合机制与接头强度

采用热 力学模拟试验机Gleeble1500D作加热设备,用Ti片和Ti箔 Ni片 Ti箔复合中间层扩散连接钨与铜及铜合金CuCrZr。结果表明,当用Ti片连接钨与铜,连接温度下Ti与Cu反应但未转化成液相时,则反应层由具有一定脆性的多层化合物组成,接头强度偏低;当Ti片通过共晶反应转化成液相且大部分液相被挤出连接区时,接头强度显著提高,最高达220MPa。用Ti Ni Ti复合中间层连接钨与CuCrZr时,结合界面是通过Ti分别与Ni、W及Cu相互扩散并反应生成多层化合物和固溶体而形成的;与Ti片连接钨与铜的接头形成相似,连接过程中Ti箔未转化成液相时接头强度偏低,Ti箔转化成液相时接头强度明显提高。     

用Ti/Cu/Ni中间层二次部分瞬间液相连接Si3N4陶瓷的研究

采用Ti/Cu/Ni中间层对Si3N4陶瓷进行二次PTLP连接,研究Ti箔厚度、连接工艺参数对Si3N4/Ti/C/Ni连接强度和界面结构的影响.结果表明Ti箔厚度对连接强度的影响是通过对反应层厚度的影响体现的;在本文试验条件下,改变二次连接工艺参数对Si3N4/Ti/Cu/Ni二次PTLP连接界面反应层厚度无明显影响,其对室温强度的影响是由于连接接头残余应力的变化所导致的;Si3N4/Ti/Cu/Ni二次PTLP连接界面微观结构为Si3N4/反应层/Cu-Ni固溶体层(少量的Cu-Ni-Ti)/Ni.     

以Ti/V/Cu、V/Cu为中间层的TiAl合金

用真空扩散连接方法对TiAl/Ti/V/Cu/40Cr钢及TiAl/V/Cu/40Cr钢进行了研究。结果表明,以Ti/V/Cu作中间层的接头拉伸强度高于以V/Cu作中间层的接头强度。界面分析显示,Ti/V、V/Cu、Cu/40Cr钢的各个结合界面处未形成金属间化合物,而TiAl/Ti的结合界面上有Ti3Al产生;在TiAl/V的界面上有Ti3Al、Al3V两种金属间化合物产生;界面上脆性金属间化合物的产生是接头发生断裂的原因。     

脉冲电流辅助粉末夹层TLP连接SiC_p/Al接头微观组织和力学性能

研究脉冲电流辅助瞬间液相(Transient Liquid Phase,TLP)扩散连接技术,采用粉末中间层,利用低压高强脉冲电流通过铝基复合材料搭接面与中间层,从而实现对SiC_p/2024Al复合材料板材的TLP扩散连接。分析不同工艺参数下连接试样的微观组织和力学性能,探索脉冲电流对铝基复合材料连接的影响机理。结果表明:采用真空压强为1×10~(-3)Pa,平均电流密度115 A/mm~2,连接预紧压力为0.5 MPa,连接时间60 min条件下,连接接头形成了良好的冶金连接界面,无缺陷产生;通过对连接接头微观组织观察发现,在脉冲电流作用下,接头原位生成弥散的高强度高硬度金属间化合物增强相,有效地提高了接头的力学性能。     

Ti/Cu接触反应液相层生长规律研究

针对Ti/Cu接触反应界面层的形貌以及液相层的出现和生长规律进行研究.以Cu/Ti/Cu嵌入式整体结构试验件为试验对象,研究接触熔化过程中,Ti/Cu扩散偶界面微观组织形貌的演变过程、界面反应层的出现以及生长规律.     

Microstructural formation and mechanical performance of friction stir double-riveting welded Al-Cu joints

A novel friction stir double-riveting welding (FSDRW) technology was proposed in order to realize the high-quality joining of upper aluminum (Al) and lower copper (Cu) plates, and this technology employed a Cu column as a rivet and a specially designed welding tool with a large concave-angle shoulder. The formations, interfacial characteristics, mechanical properties and fracture features of Al/Cu FSDRW joints under different rotational velocities and dwell times were investigated. The results showed that the well-formed FSDRW joint was successfully obtained. The cylindrical Cu column was transformed into a double riveting heads structure with a Cu anchor at the top and an Al anchor at the bottom, thereby providing an excellent mechanical interlocking. The defect-free Cu/Cu interface was formed at the lap interface due to the sufficient metallurgical bonding between the Cu column and the Cu plate, thereby effectively inhibiting the propagation of crack from the intermetallic compound layer at the lap interface between the Al and Cu plates. The tensile shear load of joint was increased first and then decreased when the rotational velocity and dwell time of welding tool increased, and the maximum value was 5.52 kN. The FSDRW joint presented a mixed mode of ductile and brittle fractures.     

Joining of SiO2 ceramic and TC4 alloy by nanoparticles modified brazing filler metal

Nano-Al₂O₃ particles modified AgCuNi filler was adopted to braze the SiO₂ ceramic and TC4. The effects of filler size as well as the brazing temperature on the interfacial microstructure and mechanical property of the joints were investigated. Nanoscale filler reduced the phases dimension and promoted the homogeneous distribution of microstructure, obtaining a higher joint strength when compared to microscale filler. The increase of brazing temperature made the accelerating dissolution and diffusion of Ti, which promoted the increase of thickness of Ti₄O₇ + TiSi₂ layer adjacent to SiO₂ ceramic and diffusion layer zone nearby TC4 alloy. The hypoeutectic structure was produced in the brazing seam due to the high Ti content. The maximum shear strength of ∼40 MPa was obtained at 950 °C for 10 min.     

TiAl合金与40Cr钢的真空钎焊研究

采用Ag-Cu-Ti钎料进行了TiAl合金与40Cr钢的真空钎焊连接,用拉伸试验对接头的连接强度进行检验,采用扫描电镜、电子探针和X-射线衍射分析等手段对接头断口的形貌、界面原子扩散、界面反应及界面产物进行了分析.研究结果表明,采用Ag-Cu-Ti钎料时得到的焊缝具有很高的强度(426MPa),是因为钎料和TiAl母材中的Ag,Cu,Ti原子发生了互扩散,而且在钎料与母材的界面发生了界面反应,形成了AlCu2Ti相,实现了冶金上的结合.     

Influence of welding parameters on microstructure and mechanical properties of electron beam welded Ti60 to GH3128 joint with a Cu interlayer

Effects of welding parameters on the microstructure and mechanical properties of Ti/Cu/Ni joint welded by electron beam were investigated. High welding heat input increased the melting quantity of Ti60 titanium alloy and promoted the formation of Ti–Cu intermetallic compounds (IMC) such as Ti₂Cu and Ti₃Cu₄, increasing the brittleness of the joints. Low welding heat input was not conducive to the complete melting of the copper interlayer, and the unmelted copper reduced the performance of the joints. Under the optimal welding parameters, Ti–Ni IMCs in the weld would be replaced by (Cu, Ni) solid solutions ((Cu, Ni)_ss). However, Ti–Cu IMC layers cannot be eliminated entirely by changing the welding parameters. The maximum tensile strength of the joints was 201 MPa. The fracture of the joints occurred at the Ti–Cu IMC layer, which was a typical brittle fracture.     

Effect of adding Nb foil on joint properties of laser fusion welding for TC4 titanium and 7075 aluminum alloy

It is difficult to gain effective Ti-Al fusion welding joints due to their differences in thermal properties and the appearance of brittle Ti-Al Intermetallic Compounds (IMCs). The experiments of laser fusion welding for TC4 titanium and 7075 aluminum alloy were carried out, temperature field and ductility/brittleness, as well as chemical potential of elements, were calculated, and the effect of adding Nb foil on mechanical properties of the weld was also investigated. The results suggested that Nb atoms tend to diffuse toward Al side, which is conducive to the participation of Nb in the metallurgical reaction and contributes to forming the Ti-Nb-Al IMC layer at the interface. As the thickness of Nb foil increases, the tensile-shear force of joint climbs first but then declines, and reaches the highest value of 1663 N with 0.10 mm-thickness Nb foil, representing 58.38% enhancement compared with the non-added one. Adding Nb foil slows down the heat transfer as a blocker, and thus both the melting amount of Al and the mixing area of Ti and Al decrease. In addition, Nb alloying reduces the brittleness of the Ti-Al compound. Hence, the joint properties of titanium/aluminum are improved with the addition of Nb foil.