| 关于国军标电子元器件密封性试验的探讨 |
| |
| 引用本文： | 张丹丹,武建文. 关于国军标电子元器件密封性试验的探讨[J]. 北京航空航天大学学报, 2004, 30(2): 173-176 |
| |
| 作者姓名： | 张丹丹 武建文 |
| |
| 作者单位： | 北京航空航天大学 自动化科学与电气工程学院, 北京 100083 |
| |
| 摘 要： | 通过理论分析论证了国家军用标准关于电子元器件密封性试验中存在的问题,提出了改进方案,为实现科学控制军品密封质量提供了参考依据.结合某厂密封性试验中细检漏的失效数据,说明国军标应对实验条件严格控制的必要性.
|
| 关 键 词： | 密封 可靠性 漏气率 细检漏 国军标 |
| 文章编号： | 1001-5965(2004)02-0173-04 |
| 收稿时间： | 2002-10-16 |
| 修稿时间： | 2002-10-16 |
Discussion about seal test of electronics in GJB |
| |
| Zhang Dandan,Wu Jianwen. Discussion about seal test of electronics in GJB[J]. Journal of Beijing University of Aeronautics and Astronautics, 2004, 30(2): 173-176 |
| |
| Authors: | Zhang Dandan Wu Jianwen |
| |
| Affiliation: | School of Automation Science and Electrical Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China |
| |
| Abstract: | The problems about sealing test of electronics in GJB were analyzed. Improved methods were presented, which provide the references for controlling the seal quality of military products scientifically. Failure data from a seal test processed by some factory are given to illustrate the importance of strictly controlling test conditions. |
| |
| Keywords: | sealing reliability leak rate fine leak GJB |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
| 点击此处可从《北京航空航天大学学报》浏览原始摘要信息 |
|
点击此处可从《北京航空航天大学学报》下载全文 |
