| 空间碳纤维壳结构导热增强方法试验研究 |
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| 引用本文： | 庞乐,孙敬文,赵凯璇,代善良,刘刚,彭聪. 空间碳纤维壳结构导热增强方法试验研究[J]. 中国空间科学技术, 2019, 39(2): 13. DOI: 10.16708/j.cnki.1000-758X.2019.0004 |
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| 作者姓名： | 庞乐 孙敬文 赵凯璇 代善良 刘刚 彭聪 |
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| 作者单位： | 上海卫星装备研究所，上海200240 |
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| 基金项目： | 国家重点研发计划资助（2017YFA0204600） |
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| 摘 要： | 为提高空间碳纤维复合材料壳结构的导热能力，降低热控设计难度,并提高热控系统可靠性,设计了包含贴覆石墨高导热膜材料以及在外部包覆的多层隔热组件内增加高导热膜等在内的3种导热增强措施，分别按这3种方法制作了试件，并增加了对照组，进行了真空热试验。试验结果表明，贴覆石墨高导热膜材料的方法使碳纤维壳结构试件的当量导热系数增大了7倍，相较其他方法具有明显优势。若该方法与包覆含有高导热膜夹层的多层隔热组件的方法协同使用，可以取得更好的效果。
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| 关 键 词： | 碳纤维复合材料（CFRP） 导热增强 当量导热系数 真空热试验 |
| 收稿时间： | 2018-08-22 |
Exprimental study on thermal conductivity enhancement technique for space carbon fiber shell structure |
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| PANG Le,SUN Jingwen,ZHAO Kaixuan,DAI Shanliang,LIU Gang,PENG Cong. Exprimental study on thermal conductivity enhancement technique for space carbon fiber shell structure[J]. Chinese Space Science and Technology, 2019, 39(2): 13. DOI: 10.16708/j.cnki.1000-758X.2019.0004 |
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| Authors: | PANG Le SUN Jingwen ZHAO Kaixuan DAI Shanliang LIU Gang PENG Cong |
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| Affiliation: | Shanghai Institute of Spacecraft Equipment, Shanghai200240, China |
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| Abstract: | In order to improve the thermal conductivity of space Carbon Fiber Reinforced Plastics (CFRP) shell structure, three techniques of enhancing thermal conductivity were designed, and vacuum thermal test was performed on the specimens which were treated according to these techniques, control group was prepared as well. These techniques include bonding high thermal conductivity film materials on the specimens’ surface and cladding multi layer insulation with high thermal conductivity film interlayers. According to test results, the technique of bonding carbon carbon composites film has an obvious advantage over the other two, increasing the thermal conductivity of CFRP shell structure by seven times. If this technique is used in conjunction with multi layer insulation cladded with high thermal conductivity film interlayer, better results can be achieved. |
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| Keywords: | Carbon Fiber Reinforced Plastics (CFRP) thermal conductivity enhancement equivalent coefficient of thermal conductivity vacuum thermal test |
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