低黏度环氧树脂硼胺-酸酐复合固化体系研究

为探究低黏度环氧树脂复合固化反应机理，研究了低黏度环氧树脂硼胺-酸酐复合固化体系的流变性能和固化反应过程，分析了硼胺-酸酐复合比例对复合固化体系流变特性和固化反应过程的影响；利用流变学参数确定了复合固化体系的固化起始时间、凝胶时间点及基于阿伦尼乌斯方程的固化反应活化能。研究结果表明，随着硼胺-酸酐复合固化体系中酸酐复合比例的增加，体系固化反应获得促进，其固化起始时间和凝胶点均降低，同时基于阿伦尼乌斯方程的固化反应活化能降低；采用非等温差示扫描量热（DSC）对硼胺-酸酐复合固化体系过程进行分析，结果表明硼胺-酸酐复合固化体系存在相对独立的双放热峰，随着酸酐复合比例的增加，低温放热峰的峰值增大，高温放热峰的峰值减小，且双峰的峰值温度向高温方向移动。根据2种固化剂的固化反应机理分析，环氧树脂硼胺-酸酐复合固化体系中硼胺固化剂和酸酐固化剂既存在相互协同效应又存在相互竞争作用。 

Low-viscosity epoxy resin boramine-anhydride composite curing system

In order to explore the mechanism of composite curing reaction of low viscosity epoxy resin,boramine-anhydride The rheological properties and curing reaction process of low-viscosity epoxy resin with boramine-anhydride composite curing system were studied, and the influence of boramine-anhydride compound ratio on the rheological properties and curing reaction process of the composite curing system was analyzed. Based on Arrhenius equation, the curing time, gel time and activation energy of curing reaction of the composite curing system were determined by rheological parameters. The results show that the curing reaction is promoted with the increase of the anhydride ratio in the curing system, while the starting point of curing and the gel time point decrease, and the activation energy based on Arrhenius equation is reduced. The curing reaction process of boramine-anhydride composite curing system was analyzed by non-isothermal differential scanning calorimeter (DSC). The results indicate that relatively independent double exothermic peaks appear in the boramine-anhydride composite curing system. With the increase of anhydride ratio, the peak value of the low-temperature exothermic peak increases, the peak value of the high-temperature exothermic peak decreases, and the peak temperatures of double exothermic peaks move to the side of high temperature. According to the curing reaction mechanism of the two kinds of curing agents, two effects of mutual synergy and mutual competition between the curing agents of boramide and anhydride exist in boramine-anhydride composite curing system of epoxy resin.