三维TSV集成电路电磁敏感性分析方法

研究了三维集成电路(3D ICs)中硅通孔(TSV)的建模方法及三维集成电路电源分配网络(PDN)的建模方法,并结合印制电路板(PCB)的电源分布网络和芯片PDN模型,提出了一种对板级三维集成电路进行电源网络上电磁敏感性(EMS)的建模和协同分析方法。首先给出了地-信号(GS)结构和地-信号1-信号2-地(GSSG)结构TSV的电路模型,电路模型与数值仿真结果做了对比,验证了TSV电路建模方法的准确性。接着对PCB板级三维集成电路中PCB的电源分布网络,PCB过孔,集成电路封装参数进行建模。最后创建了一个PCB-三维集成电路电磁敏感性级联分析模型,使用该模型来研究三维集成电路对电源干扰的敏感特性,并由此指导三维集成电路的敏感性分析。

Electromagnetic susceptibility analysis method for 3D TSV ICs

This paper focuses on the circuit modeling method of through silicon via (TSV) and power distribution network (PDN) in 3D integrated circuits (3D ICs).Combined with the PDN on printed circuit board (PCB) and the chip PDN model,an electromagnetic susceptibility (EMS) modeling and collaborative analysis method for 3D ICs on PCB was proposed.Firstly,a ground-signal (GS) TSV pair and two TSV pairs of ground-signall-signal2-ground (GSSG) were established in,and these circuit models were compared with the numerical simulation results,which validated the accuracy of the circuit modeling method of TSV.Then,the modeling method of PDN of PCB,PCB through via hole,IC's package parameters in an IC were discussed.Finally,an EMS cascade connection analysis model from PCB to 3D ICs was developed and used to analyze the electromagnetic susceptibility characteristics of 3D ICs to power interference,which can guide the susceptibility analysis of 3D ICs.