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芯片间时间触发通信综合规划方法及其优化
引用本文:汪晶晶,李峭,熊华钢,李二帅.芯片间时间触发通信综合规划方法及其优化[J].北京航空航天大学学报,2020,46(1):170-180.
作者姓名:汪晶晶  李峭  熊华钢  李二帅
作者单位:北京航空航天大学 电子信息工程学院, 北京 100083
基金项目:装备预研基金61403120404中国民航大学天津市民用航空器适航与维修重点实验室开放基金2017SW02载人航天预先研究项目060301
摘    要:随着片上系统(SoC)的处理能力逐渐接近传统的综合核心处理模块,航空电子系统向着微小型综合化的芯片间系统发展;时间触发交换式互连可以保证芯片间消息传递的严格时间确定性。考虑芯片间互连交换结构轻量化和收发端口有限的特点,在拓扑、路由和调度时刻等网络资源相互制约的条件下,提出了芯片间时间触发通信综合规划方法,即根据时间触发消息集合和芯片端口配置,同时求解得到芯片间网络拓扑结构、消息路由和调度时刻表的规划结果。其中,采用免疫算法整体优化了各条消息在网络资源分配过程中的求解次序。仿真实验表明,与不考虑整体优化的综合规划方法相比,优化后的规划结果在减少拓扑结构中多余路径开销的同时,避免消息传输路径拥堵,降低消息端到端延迟,保证了消息集的可调度性。 

关 键 词:芯片间互连    时间触发通信    元启发式算法    免疫算法    拓扑规划    路由    调度
收稿时间:2019-04-01

Integrated planning method and optimization for off-chip time-triggered communication
Institution:School of Electronics and Information Engineering, Beihang University, Beijing 100083, China
Abstract:As the processing capacity of system-on-chip (SoC) is getting close to the traditional integrated core processing module, the avionics system is developing towards the miniature, integrated off-chip system. Time-triggered switched interconnection can guarantee the strictly time deterministic property of off-chip message transmission. Considering the off-chip interconnection characteristics of lightweight switch structure and limited port number on a chip, an integrated planning method for off-chip time-triggered communication was proposed under the condition of interaction among topology planning, routing and scheduling. Given time-triggered message sets and port configuration, the off-chip interconnection network topology, message routing and scheduling table were obtained at the same time. Then the message allocation order is optimized using immune algorithm to further improve the performance of the algorithm. The simulation results show that, compared with the integrated planning method without consideration of overall optimization, the optimized method reduced the congestion on message transmission paths, reduced the message end-to-end delay and increased the schedulability of message sets while generating the off-chip interconnection topology with low costs. 
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