基于热电类比法的光纤陀螺环模块热分析

为分析光纤陀螺（FOG，Fiber-Optic Gyroscope）受外界环境变化温度影响导致产生Shupe误差，采用热电类比法对不同结构形式的光纤环（FOR，Fiber Optical Ring）模块进行热分析，比较对应的电路模型，提出并联的热容和串联的电阻是影响FOG温度性能的关键因素.采用有限元热仿真定性分析了并联的热容和串联的电阻对FOG温度的影响，验证了电路模型的正确性；在与热仿真相同条件下，通过温箱实验，将FOR温度变化与FOG输出性能建立关联.结果表明，通过加大FOR模块连接处的串联热阻和并联热容，可有效降低FOR的瞬时温差，尤其是较大的热容能有效减小FOR温变速率，从而减小Shupe误差，改善FOG的温度性能.

FOG ring modules thermal analysis based on thermoelectric analogy

For the fiber-optic gyroscope (FOG) was easily influenced by the ambient temperature resulting Shupe bias, the thermoelectric analogy method was applied to do the thermal analysis of different structural fiber optic ring (FOR) modules. The principle that the parallel heat capacity and series resistance were the key factor on the FOG thermal performance was proposed by comparing the corresponding circuit model. The parallel heat capacity and series resistance affecting the FOG temperature qualitatively was analyzed and the correctness of the circuit model was verified via finite element thermal simulation. In the same condition with the thermal simulation, the FOR temperature was associated with the FOG output performance after a temperature test cabinet experiment. The results show that increasing the parallel heat capacity and series resistance in FOR modules can reduce the ambient temperature effect on the FOR. Especially, the larger heat capacity can effectively reduce the FOR temperature change rate, thereby reducing the Shupe bias and improving the FOG thermal performance.