熔融石英半球谐振子亚表面缺陷的湿法刻蚀工艺

为了提高半球谐振子的品质因数，提出采用湿法刻蚀的方法去除半球谐振子亚表面的微缺陷。通过研究熔融石英材料的湿法刻蚀机理，在专用半球谐振子湿法刻蚀设备上能够稳定实现半球谐振子亚微米刻蚀精度，半球谐振子经过湿法刻蚀后表面粗糙度优于100nm，半球谐振子Q值能够提高至2000万以上，半球谐振子频差变化小于0.03Hz。

Wet Etching Process for Subsurface Defects of Fused Silica Hemispherical Shell Resontor

In order to improve the quality factor of the Hemispherical Shell Resontor(HSR), a wet etching method is proposed in this paper to remove the micro-defects on the subsurface of the HSR. By investigating the wet etching mechanism of the fused silica material, an accuracy of sub-micron etching level can be achieved by utilizing specialized wet etching equipment. The experimental results show that the surface roughness of HSR after wet etching is reduced to less than 100nm, the quality factor of HSR can be increased to more than 20 million, and the frequency split is guaranteed to be less than 0.03Hz.