| 带PMC背板的VME模块热加固技术研究 |
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| 引用本文： | 焦超锋,张丰华,姜红明,醋强一.带PMC背板的VME模块热加固技术研究[J].航空计算技术,2008,38(3):104-106. |
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| 作者姓名： | 焦超锋 张丰华 姜红明 醋强一 |
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| 作者单位： | 中国航空计算技术研究所,陕西,西安,710068 |
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| 摘 要： | 目前,大量的工业级芯片及电子模块产品已经开始运用到军用电子产品领域.通过对某机栽计算机中的带PMc背板的VME模块的热加固方法进行分析,阐述了工业级芯片及电子模块产品军用化的热加固基本思想和方法,揭示了在对工业级产品进行加固时应注意的问题,从而为有效解决该类模块的热加固问题打下基础.
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| 关 键 词： | 电子产品 热加固 VME |
Research of Heat Ruggedization Technique of the VME Model Equipped With PMC Card |
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| JIAO Chao-feng,ZHANG Feng-hua,JIANG Hong-ming,CU Qiang-yi.Research of Heat Ruggedization Technique of the VME Model Equipped With PMC Card[J].Aeronautical Computer Technique,2008,38(3):104-106. |
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| Authors: | JIAO Chao-feng ZHANG Feng-hua JIANG Hong-ming CU Qiang-yi |
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| Abstract: | Currently,a large number of industrial products and commercial products have been used in military equipment system.How this type of products to be ruggedized?By analysing the ruggedization method of the VME module equipped with PMC card in some airborne computer,we expatiated on the basic idea and the method of the heat ruggedization problem for industrial components and modules used in military equipment system.At the same time we posted some problems should be pay attention during deal with heat ruggediz... |
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| Keywords: | electronics products heat ruggedization VME |
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