基于约束方程建模技术的CCGA封装力学特性仿真

为探讨CCGA高密度封装结构在整机设备中的有限元建模方法,分析CCGA封装在力学激励下的响应,选用了不同的有限元单元对CCGA封装结构进行了建模,采用了约束方程方法处理不同单元所引起的求解自由度不协调问题,根据CCGA封装模型特点编写了约束方程自动建模程序。基于约束方程方法建立的有限元模型,对包含CCGA封装结构的设备整机进行了随机振动激励下的有限元仿真,得到了随机振动激励下封装的响应。通过包含CCGA封装结构的有限元模型建模过程可以看出:自动约束方程建模方法可以有效地处理实体单元与梁单元建模引起的自由度不协调问题,为包含高密度封装的设备整机有限元建模提供了新的思路;CCGA封装结构力学特性仿真结果可以较全面反映封装响应,为CCGA芯片的加固措施提供了根据。

Mechanical Characteristics Simulation of CCGA Package Based on Constraint Equation Technology

To discuss the finite element modeling method of CCGA high density package structure in the whole machine and to analyze the mechanical response of CCGA package,different elements were selected to build the finite element model of CCGA package and constraint equation method was used to process the problem of degree of freedom disagreement for different finite element.Automatic modeling program was developed according to the characteristic of CCGA structure.The random vibration simulation was executed based on the finite element model of whole machine including CCGA package structure using constraint equation method and CCGA package response was gotten under the excitation of random vibration.The procedure of building the finite element model for the structure including CCGA package shows modeling method using automatic constraint equation can effectively process the disagreement of degree of freedom causing by solid and beam element and also provide the new idea for the finite element modeling of the whole machine including high density package.The results of mechanical characteristic simulation can demonstrate the CCGA package response completely and provide the basis to fix the CCGA chip.