一种高密度电子模块的热设计

随着工业档表贴器件在机载电子设备中日益广泛的使用,模块的热设计成为影响产品性能的关键技术。对一种高密度电子模块的热设计进行了研究,简要分析了影响散热效果的几种因素,提出了采用顶部导热板散热的新型结构,经过热性能测试和试飞验证,可以满足系统的热设计要求。

Thermal Design of a High Density Electronic Module

With the SMD components were being widely used in electronics equipments, the thermal design of the module is becoming the key technique which influences the product's performance. By doing a thermal design research of a high density electronic module, this paper formulates the factors which influence the effect of heat dissipation. At the same time, a new kind of heat conduction board which dissipates heat from top side of the components is being brought forward. Passing through the thermal performance test and flight test, this structure is certificated can be met the system's thermal design demand.