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机载电子设备冷却散热技术的发展
引用本文:张娅妮,陈菲尔,田沣.机载电子设备冷却散热技术的发展[J].航空计算技术,2012(4):113-116.
作者姓名:张娅妮  陈菲尔  田沣
作者单位:[1]中航工业西安航空计算技术研究所,陕西西安710068 [2]北京航空航天大学电子信息工程,北京100191
基金项目:航空科学基金项目资助(20100231)
摘    要:机载电子设备高性能、高可靠、低成本的发展趋势对冷却散热技术不断提出更高的要求。详细介绍了用于机载电子设备的风冷、液冷以及其他新型冷却散热技术,阐述了各种散热技术的原理和特点,探讨了未来机载电子设备冷却散热技术的发展方向。研究结果表明:液冷必将取代风冷成为机载电子设备的主要冷却散热方式。未来机载电子设备还将采用混合冷却的设计方案,最大限度地发挥电子设备的热性能,提高机载电子设备综合化设计能力。

关 键 词:风冷  液冷  新型冷却  混合冷却

Development on Heat Dissipation Technique of Airborne Electronic Equipment
ZHANG Ya- ni,CHEN Fei- er,TIAN Feng.Development on Heat Dissipation Technique of Airborne Electronic Equipment[J].Aeronautical Computer Technique,2012(4):113-116.
Authors:ZHANG Ya- ni  CHEN Fei- er  TIAN Feng
Institution:1. Xi'an Aeronautics Computing Technique Research Institute ,AVIC ,Xi'an 710068, China ; 2. Electronic and Information Engineering Institute, Beihang University, Beijing 1 O0191, China)
Abstract:Further Requirements of heat dissipation technique will be presented continuously because of high performance, high reliability and low cost development of Airborne Electronic Equipment. Air cool- ing,liquid cooling and other new- type cooling techniques were introduced detailed in this paper. The principles and characteristics of above- mentioned technique were formulated. The technical development orientation of future airborne electronic- equipment was discussed. The results showed that air cooling will be replaced certainly by liquid cooling. Mixing cooling will be adopted in future airborne electronic equip- ment which display the thermal performance furthest and advance the integrative projected capacity of air- borne electronic equipment.
Keywords:air cooling  liquid cooling  new- type cooling  mixing cooling
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