| 射流冷却技术研究 |
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| 引用本文： | 田沣.射流冷却技术研究[J].航空计算技术,2006,36(3):4-7. |
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| 作者姓名： | 田沣 |
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| 作者单位： | 中国航空计算技术研究所,陕西,西安,710068 |
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| 摘 要： | 随着电子封装密度的不断提高,液体循环冷却已难以满足部分大功率电子冷却的要求.由于射流冷却的效率大大高于液体循环冷却,目前已成为电子冷却领域的前沿技术.本文对射流冷却基本原理进行了探讨,简述了这一领域的研究发展状况并针对应用提出作者的一些看法.
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| 关 键 词： | 射流 蒸发 冷却技术 |
| 文章编号： | 1671-654X(2006)03-0004-04 |
| 修稿时间： | 2006年2月16日 |
Research on Spray Cooling Techniques |
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| TIAN Feng.Research on Spray Cooling Techniques[J].Aeronautical Computer Technique,2006,36(3):4-7. |
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| Authors: | TIAN Feng |
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| Abstract: | With the increasingly advance of electronics packaging density,the liquid cooling cannot meet requirements of some big power electronic devices.Because the efficiency of the spray cooling is greatly higher than the liquid cooling,the spray cooling is becoming the advanced cooling method at present.The principle of the spray cooling is discussed in this paper,at the same time the development status of the spray cooling is expatiated.For its application the author mentioned his idea. |
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| Keywords: | spray vaporize cooling technique |
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