| 利用金刚石微颗粒进行微米级加工的研究 |
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| 引用本文： | 王凯建.利用金刚石微颗粒进行微米级加工的研究[J].航空学报,2001,22(5):429-433. |
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| 作者姓名： | 王凯建 |
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| 作者单位： | 北京大学力学与工程科学系 北京 100871 |
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| 摘 要： | 为确立用金刚石微颗粒对硬脆性材料进行微加工的技术基础,在进行了螺旋切入方式的运动学和力学模式的解析后,对用金刚石微颗粒进行磨削微加工的最佳条件进行了探讨。在此基础之上,用电镀有金刚石微颗粒的工具和螺旋切入磨削方式,成功地实现了对玻璃、硅片等各种各样的硬脆性材料的100μm尺度的高精度加工。
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| 关 键 词： | 金刚石微颗粒 螺旋切入 磨削 微加工 硬脆性材料 |
| 文章编号： | 1000-6893(2001)05-0429-05 |
| 收稿时间： | 2000-09-01 |
| 修稿时间： | 2000年9月1日 |
ULTRA-SMALL SCALE GRINDING WITH DIAMOND ELECTRIC PLATING TOOL (HELICAL-FEED DRILLING MECHANICAL GRINDING METHOD) |
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| WANG Kai,jian.ULTRA-SMALL SCALE GRINDING WITH DIAMOND ELECTRIC PLATING TOOL (HELICAL-FEED DRILLING MECHANICAL GRINDING METHOD)[J].Acta Aeronautica et Astronautica Sinica,2001,22(5):429-433. |
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| Authors: | WANG Kai jian |
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| Institution: | Department of Mechanics and Engineering Science, Peking University, Beijing 100871, China |
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| Abstract: | For establishing the basic technology of micro manufacture with diamond grains on hard and brittle materials, this paper studied the optimization condition of the ultra small scale grinding with diamond electric plating tool through analyzing the kinematics and mechanics model of the helical feed drilling mechanical grinding method. Following the analyzes, the author successfully realized the high precision micro manufacture with the diamond electric plating tool and the helical feed drilling mechanical grinding method on glasses, silicon and so on. |
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| Keywords: | diamond grain helical feed drilling method grinding ultra small scale manufacture hard and brittle materials |
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