钛表面阳极氧化处理对TA2/聚醚醚酮（PEEK）粘结性能的影响

为了改善TA2/C_f/PEEK纤维金属混杂层板中TA2/PEEK的界面粘结性能，利用NaTESi恒压阳极氧化法对TA2板进行表面改性。首先通过正交试验对阳极氧化工艺进行优化，对不同处理工艺的TA2板表面进行了XRD、SEM分析以及粗糙度的表征；其次，研究了钛板表面改性对TA2/PEEK界面结合强度及断裂韧性的影响。结合扫描电镜图进行表面粗糙度及剪切强度的极差分析，发现随着阳极氧化时间的增长，表面粗糙度减小，TA2/PEEK接头的单搭剪切强度下降。对不同工艺下单搭接头的拉伸剪切强度进行比较后，确定了利于提高TA2/PEEK界面结合强度的最优工艺为恒压10 V、在35℃下阳极氧化10 min；该种工艺处理后的钛板表面粗糙度为1.34 μm，其表面形貌为纳米颗粒，粒径尺寸为100~200 nm，在阳极氧化时间为10 min、电压为10 V时，其表面纳米颗粒分布最为均匀，该种形貌下制备的TA2/PEEK界面剪切强度达到19 MPa，失效模式为混合破坏；通过载荷-位移曲线、R曲线，对此工艺下TA2/PEEK界面I型层间断裂韧性进行了表征，发现其平均能量释放率为188.1 J/m²，相比于未经表面处理的试样增加了103.1%，阳极氧化工艺处理后的TA2/PEEK界面抗分层能力更好。

Effects of Titanium Surface Anodization on Adhesive Bonding Properties of TA2/polyetheretherketone(PEEK)

Surface treatment on titanium sheets by NaTESi anodization at constant voltage is conducted to improve the bonding properties of TA2/polyetheretherketone (PEEK) in TA2/C_f/PEEK laminates. The effects of technical parameters (such as voltage, time and temperature) on the single lap joint shear strength and the surface roughness of TiO₂ film are investigated by an orthogonal test. It demonstrates that the most important factor affecting the bonding properties is time. Longer anodization times resuted in lower surface roughness, which contributed to inferior bonding properties. Properties of the TA2 laminate are investigated by XRD and SEM, and the results show that the optimized process which is favorable for the increase of the bonding strength is as follows: anodizing voltage 10 V, anodizing temperature 35℃ and anodizing time 10 min. The surface roughness treated by this method is 1.34 μm and the nano-particles morphology appeares, which the size of the particles is about 100-200 nm. The single lap joint shear strength with these parameters could reach 19 MPa. The resistance to delamination between the titanium sheet and PEEK in this optimized process is measured in a double cantilever beam test. The average energy release rate of the TA2/PEEK interface which was prepared by the method of NaTESi anodization is 188.1 J/m², which showes an increase of 103.1% compared with the untreated ones. The results indicate that the anodizing process markedly enhance the delamination resistance of TA2/PEEK bonding interface.