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Dependence on forming parameters of an integral panel during the electromagnetic incremental forming process
Authors:Jinqiang TAN  Mei ZHAN  Hongwei LI
Institution:State Key Laboratory of Solidification Process, School of Materials Science & Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Abstract:Nowadays, more and more attentions are paid to electromagnetic incremental forming (EMIF), especially for a part with a large-scale size, e.g., an integral panel with stiffened ribs. In this work, the bending of a panel into a double-curvature profile via EMIF is carried out experimentally and evaluated by comparing the formed profile with the desired profile. During the process, discharges at four positions along different discharge paths are designed. The effects of forming parameters on the die-fittingness of the workpiece are discussed, for which two evaluation indices are used to judge forming results. The results show that a discharge voltage in an incremental mode is helpful to improve the fittingness and avoid the collision rebound against the die at the same time. Discharging at the diagonal positions with the “X” discharge path exhibits the minimal shape deviation and the best forming uniformity. On the contrary, discharging at the parallel positions with the “Z” discharge path obtains the worst forming quality. Overlap of the coil at different positions should be given during EMIF; however, a lower overlap rate of the coil helps improve the forming quality. The results obtained in this work are useful for forming integral panels with stiffened ribs via the EMIF process.
Keywords:Electromagnetic incremental forming (EMIF)  Forming uniformity  Integral panel  Parameters  Shape deviation
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