| 低熔体黏度聚酰亚胺树脂的合成和性能 |
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| 引用本文： | 杨慧丽,孟祥胜,范卫锋,刘敬峰,王,震.低熔体黏度聚酰亚胺树脂的合成和性能[J].宇航材料工艺,2010,40(2). |
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| 作者姓名： | 杨慧丽 孟祥胜 范卫锋 刘敬峰 王 震 |
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| 作者单位： | 中国科学院长春应用化学研究所高分子物理与化学国家重点实验室,长春,130022 |
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| 基金项目： | 973计划资助项目，吉林省科技发展计划项目 |
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| 摘 要： | 合成了两种以苯乙炔基封端的聚酰亚胺树脂,并对其熔体黏度、热性能和力学性能进行了研究。结果表明,两种树脂在280℃/2h的熔体黏度均小于1Pa.s,并具有良好的熔体黏度稳定性,可以用RTM的方法加工成型。PI-1树脂的Tg和T5d分别是402和534℃,PI-2树脂的Tg和Td5分别是356和525℃。碳纤维增强的PI-1基复合材料在300℃下具有大于70%的性能保持率。
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| 关 键 词： | 聚酰亚胺 熔体黏度 耐热性 力学性能 |
SynthesisandCharacterizationofMelt-Processable HighTemperaturePolyimideResins |
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| Institution: | TheStateKeyLaboratoryofPolymerPhysicsandChemistry,ChangchunInstituteofAppliedChemistry,ChineseAcademyofSciences,Changchun 130022 |
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| Abstract: | Two series of phenylethynyl end-capped polyimide ohgomers were synthesized and their thermal and theological and mechanical properties were characterized. The results show that two oligomers exhibit low complex melt viscosity (<1Pa·s) at 280℃/2 h and are stable at this temperature. These two oligomers can be processed by resin transfer molding techniques. T_g and T_d~5 of PI - 1 resins are 402℃ and 534℃ respectively, P1-2 resins are 356℃ and 525℃ respectively. The retention rates of properties of PI - 1 resin/carbon fabric composite are beyond 70% at 300℃. |
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| Keywords: | RTM Polyimide RTM Melt complex viscosity Thermal property Mechanical properties |
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