| 无铅焊点的可靠性研究 |
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| 引用本文： | 邹慧.无铅焊点的可靠性研究[J].中国民航学院学报,2007,25(3):49-52. |
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| 作者姓名： | 邹慧 |
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| 作者单位： | 中国民航大学理学院 天津300300 |
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| 基金项目： | 中国民航大学校科研和教改项目 |
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| 摘 要： | 基于环保和可持续发展,各国开始限制电子封装中铅的应用,而无铅焊料的研究是目前发展的重要趋势,随着钎焊材料和工艺的改变,给无铅钎焊焊点可靠性的评估带来一系列的相关问题,焊点的破坏往往导致整个封装结构的失效,本研究就无铅焊料焊点的力学测试方法和焊点寿命预测进行了讨论。
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| 关 键 词： | 无铅铅料 电子封装 焊点 寿命预测 |
| 文章编号： | 1001-5000（2007）03-0049-04 |
| 修稿时间： | 2006-12-19 |
Research on Lead-Free Solder Joint Reliability |
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| ZOU Hui.Research on Lead-Free Solder Joint Reliability[J].Journal of Civil Aviation University of China,2007,25(3):49-52. |
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| Authors: | ZOU Hui |
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| Institution: | Science College, CA UA , Tianjin 300300, China |
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| Abstract: | Considering environmental protections and sustainable development,the use of Sn-Pb solder will be totally banned in electronic packaging in many country.So the research and application of lead-free solders is the major target of next generation solders.However,it brings the problem of lead-free solder joint reliability evaluation for the change of material and techniques.The failure of one soldered joint is frequently found to be the origin of the failure of the whole package.In this paper,the test methods of mechanics and the life prediction for solder joints were presented and discussed. |
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| Keywords: | lead-free solder electronic packaging solder joint life prediction |
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