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单晶硅脆性材料塑性域超精密磨削加工的研究
引用本文:陈明君,董申,李旦,张飞虎.单晶硅脆性材料塑性域超精密磨削加工的研究[J].航空精密制造技术,2000,36(2):8-11.
作者姓名:陈明君  董申  李旦  张飞虎
作者单位:哈尔滨工业大学精密工程研究所,哈尔滨 150001
摘    要:对单晶硅脆性材料的超精密磨削加工作了大量的实验研究.研究结果表明,对于单晶硅等脆性材料,其表面粗糙度主要与砂轮的平均磨粒尺寸、进给量等因素有关.当采用超精密磨床并在V

关 键 词:单晶硅材料  超精密磨削加工  金刚石砂轮  塑性域磨削
文章编号:1003-5451(2000)02-0008-04
修稿时间:1999年10月20

Study on Ultra-precision Grinding of Single Silicon Brittle Material in the Ductile Mode
Chen Ming-jun.Study on Ultra-precision Grinding of Single Silicon Brittle Material in the Ductile Mode[J].Aviation Precision Manufacturing Technology,2000,36(2):8-11.
Authors:Chen Ming-jun
Institution:Harbin Institute of Technology Harbin 150001
Abstract:In this paper,the experimental investigation is made on the grinding of single brittle materials.It is shown that the surface roughness is mainly related with the average grain size and feed per wheel revolution for the brittle materials such as single silicon.In the case of Vs=1200m/min,f=0~500μm/rev,ap=0.1~10μm,only when the average grain size of the diamond wheel is less than 20μm,the smooth high quality surface with the roughness of rms=5.14nm,Ra=3.25nm can be obtained under the condition of grinding in the ductile mode.
Keywords:single silicon brittle material  ultra-precision grinding  diamond wheel  grinding in the ductile mode
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