Modular ICNIA Packaging Technology |
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Authors: | Poradish Frank |
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Institution: | Texas Instruments Avionics Systems Division, McKinney, Texas; |
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Abstract: | Significant size, weight, power and reliability improvements can be achieved in next generation avionics by the modular integration of similar functions into a fault tolerant reconfigurable architecture. The Integrated Communication Navigation Identification Avionics program (ICNIA), and ITT/TI Joint Venture, is accomplishing this task with a combination of modular circuit designs using VHSIC technology, improved packaging designs incorporating surface mount component technology and a modular two-level maintenance support concept for reduced life cycle cost. This article will concentrate on the modular packaging technology of the digital processor subsystem. |
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