| Ni_3Al基合金TLP扩散焊接头性能 |
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| 引用本文： | 侯金保,魏友辉,张蕾.Ni_3Al基合金TLP扩散焊接头性能[J].航空材料学报,2006,26(3):329-330. |
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| 作者姓名： | 侯金保 魏友辉 张蕾 |
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| 作者单位： | 北京航空制造工程研究所,北京,100024 |
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| 摘 要： | 介绍Ni3Al基IC10合金孔P扩散焊后接头性能,以及长时间使用后接头性能的变化,分析认为孔P扩散焊接头在高温使用过程中,原子进一步扩散,接头性能变得和基体相同.
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| 关 键 词： | Ni3AI合金 孔P扩散焊 接头性能 |
| 文章编号： | 1005-5053(2006)03-0329-02 |
| 修稿时间： | 2006年1月20日 |
Transient Liquid Phase (TLP) Diffusion Bonding of Ni3 Al Alloy |
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| HOU Jin-bao,WEI You-hui,ZHANG Lei.Transient Liquid Phase (TLP) Diffusion Bonding of Ni3 Al Alloy[J].Journal of Aeronautical Materials,2006,26(3):329-330. |
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| Authors: | HOU Jin-bao WEI You-hui ZHANG Lei |
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| Abstract: | The properties of the joint and the change of the TLP joint properties of Ni_3Al alloy IC10 after long time employment are all been investigated in this paper.The results show that the properties of the TLP joint have become the same as that of the base material with further diffusion of atoms during the employment under high temperature. |
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| Keywords: | Ni_3Al alloy TLP diffusion bonding properties of joint |
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