磁控溅射沉积工艺条件对薄膜厚度均匀性的影响

薄膜厚度均匀性是衡量薄膜质量和镀膜装置性能的一项重要指标.在自行设计的磁控溅射沉积设备上,对薄膜沉积工艺中靶基间距、溅射功率、工作气压对膜厚均匀性的影响进行了研究,由连续光谱椭圆偏光仪SE800测量薄膜厚度.结果表明:靶基间距较大的情况下,薄膜均匀性明显改善;溅射功率和工作气压对薄膜均匀性也有较大的影响.

Influences of the Process on Thickness Uniformity of Films Deposited by Magnetron Sputtering

The film thickness uniformity is an important reflection of the film quality and the device performance.The influence of the target substrate distance,sputtering power and working pressure on the film thickness uniformity deposited by self-designed magnetron sputtering deposition equipment has been studied.The film thickness measured by SENTECH Instruments GmbH's Spectroscopic Ellipsometry SE800.The result indicates that,the film has a good uniformity at a long target substrate distance.The sputtering power and working pressure also have influence on the film thickness uniformity.