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电器灌封用环氧泡沫塑料制备工艺研究
引用本文:张晓艳,王景鹤,范召东.电器灌封用环氧泡沫塑料制备工艺研究[J].航空材料学报,2003,23(Z1):186-189.
作者姓名:张晓艳  王景鹤  范召东
作者单位:北京航空材料研究院,北京,100095
摘    要:采用DSC技术和旋转粘度法对环氧发泡体系的反应过程进行深入的研究,探讨了不同预聚温度(60℃,70℃,80℃)下树脂发泡体系的粘度、固化度和时间的关系,分析了发泡速率和固化速率的匹配性,初步确定了两步法制备工艺.结果表明,制备的环氧泡沫塑料具有良好的综合性能.

关 键 词:环氧泡沫塑料    预聚    固化度    粘度    两步法
文章编号:1005-5053(2003)S0-0186-04
修稿时间:2003年6月15日

Study on the preparation of epoxy foam used for electrical sealing compond
ZHANG Xiao-yan,WANG Jing-he,FAN Zhao-dong.Study on the preparation of epoxy foam used for electrical sealing compond[J].Journal of Aeronautical Materials,2003,23(Z1):186-189.
Authors:ZHANG Xiao-yan  WANG Jing-he  FAN Zhao-dong
Abstract:The reaction of epoxy foam system was studied in detail through DSC and structural rotation viscosimeter. The results on viscosity and curing degree changed with time was discussed. Cooperativity of foaming reaction rate and curing rate was analyzed . The two-step method for preparating epoxy foam was determined initially. It was observed that the epoxy foam plastics displayed excellent synthetical properties.
Keywords:epoxy foam  prepolymerization  curing degree  viscosity  two-step method  
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