| 双合金热等静压复合工艺研究 |
| |
| 引用本文： | 毛健,汪武祥.双合金热等静压复合工艺研究[J].航空材料学报,1996,16(4):7-12. |
| |
| 作者姓名： | 毛健 汪武祥 |
| |
| 作者单位： | 北京航空材料研究院 |
| |
| 摘 要： | 主要探索采用双合金热等静压扩散连接工艺实现高温合金粉末和ＤＤ３单晶合金间可靠连接的可行性。研究内容包括热等静压（ＨＩＰ）扩散连接温度及热处理对ＦＧＨ９５—ＤＤ３复合界面的成分扩散、界面组织以及叶片材料本身组织性能的影响。研究表明，通过合理的工艺选择与改进，可以在保证对偶材料性能满足要求的前提下实现界面的良好扩散与结合。
|
| 关 键 词： | 扩散连接，热等静压，界面反应，高温合金 |
A STUDY OF DUAL-ALLOY HIP DIFFUSION BONDING TECHNOLOGY |
| |
| Mao Jian,Wang Wuxiang, Hu He, Yang Wanhong, Wu Zhongtang.A STUDY OF DUAL-ALLOY HIP DIFFUSION BONDING TECHNOLOGY[J].Journal of Aeronautical Materials,1996,16(4):7-12. |
| |
| Authors: | Mao Jian Wang Wuxiang Hu He Yang Wanhong Wu Zhongtang |
| |
| Abstract: | The development of HIP diffusion bonding of FGH95 superalloy powder and DD3 single crystal has been explored.The effects of HIP bonding temperature and heat treatment on element diffusion and precipitation at FGH95-DD3 interface have been discussed.The variations of microstrueture and mechanical properties of DD3 single crystal after hipping have also been investigated.The results show that perfect diffusion and bonding at powder-crystal interface can be achieved by proper process control,the properties of DD3 single crystal can alsobe maintained up to the desired levels after HIP diffusion bonding |
| |
| Keywords: | diffusion bonding HIP interface reaction superalloy |
| 本文献已被 CNKI 维普 等数据库收录！ |
