| 高体积分数SiCp/Al复合材料高温压缩界面研究 |
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| 引用本文： | 曾莉,任学平,崔岩.高体积分数SiCp/Al复合材料高温压缩界面研究[J].航空制造技术,2012(Z1):117-120,124. |
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| 作者姓名： | 曾莉 任学平 崔岩 |
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| 作者单位： | 北京科技大学材料科学与工程学院;北京航空材料研究院先进复合材料国防科技重点实验室 |
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| 基金项目： | 国家高技术(863)项目(2007AA03Z544)资助 |
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| 摘 要： | 采用无压浸渗制备出高体积分数SiCp/Al多功能复合材料。对该复合材料进行了高温(高于基体熔点)压缩实验。利用XRD和TEM观察了SiCp/Al复合材料的界面结构,分析了高温压缩对复合材料界面的影响,研究了复合材料的复合机理。结果表明:高温压缩后的SiCp/Al复合材料的界面过渡层连续且厚度均匀,过渡层宽度减小了一个数量级;复合材料SiCp/Al界面结合机制包括扩散、位向和反应结合机制,复合材料SiCp/Al界面的这些结合机制,导致了增强相与基体之间很强的界面结合;复合材料的断裂方式为颗粒断裂,SiC增强颗粒与Al基体结合良好。
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| 关 键 词： | SiCp/Al复合材料 高温压缩 界面 复合机理 |
Study on Interface of SiCp/Al Composites With High Volume Fraction by High Temperature Compression |
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| Abstract: | SiCp/Al composites with high volume fraction is prepared by pressureless infiltration. High temperature hot above melting point on the composites is tested. Interfacial structure of composites is observed by using XRD and TEM. Effects of high temperature compression on the interface of composites are analyzed. Compound mechanism is researched. The results show that interfacial transition layer of SiCp/Al composites by high temperature compression is continuous and uniform thickness, the transition layer decrease by almost one order of magnitude. Interfacial bonding mechanism of SiCp/ Al composites contained diffusion mechanism, orientation mechanism and reaction bonding mechanism, these mechanisms of SiCp/Al composites result in a strong interfacial bond. Fracture mechanism of composites is particle fracture, the bond of SiC particles and Al matrix is good. |
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| Keywords: | SiCp/Al composites High temperature compression Interface Compound mechanism |
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