MEMS加速度计的封装建模与粘胶优化

随着MEMS加速度计应用领域的逐渐扩大，其工作环境的温度区间跨度也在不断增大，如何降低由封装过程引入的温度漂移量是MEMS加速度计设计的关键。对一种玻璃-硅-玻璃梳齿加速度计的完整封装结构进行了建模，并且对5种粘胶方式进行了热应力形变仿真，对仿真中温度性能最好的远三点粘胶和最差的全面粘胶这两种方式进行了装表与温度系数测试。实测结果表明，远三点粘胶的加速度计温度性能相比全面粘胶提升了2.5倍，与仿真结果相符。

Packaging Modeling and Viscose Optimization of MEMS Accelerometer

With the expansion of the application field of MEMS accelerometer, the temperature range of its working environment is also increased gradually. How to reduce the temperature drift introduced by packaging process is the key to the design of MEMS accelerometer. In this paper, the whole packaging structure of a Glass-Silicon-Glass comb accelerometer is modeled, and the thermal stress deformation is simulated for five different viscose ways. In the simulation, the far-three-point-viscose packaged accelerometer with the lowest temperature drift and the comprehensive viscose with the highest temperature drift are tested. The measured results show that the far-three-point-viscose packaged accelerometer performed 2.5 times better than the comprehensive-viscose packaged accelerometer in temperature drift, which is consistent with the simulation result.