基于MCM&SOC方案的微惯性器件系统集成技术综述

近年来,在航空航天、武器装备、高端工业等领域的制导、控制等应用需求的牵引下,微惯性器件的尺寸、质量与功耗(SWaP)指标不断提升,配套电路由PCB逐步升级为ASIC。综合工艺复杂度、成本、性能潜力等因素,基于MCM和SoC的MEMS结构与ASIC系统集成方案逐步成为目前的主流选择。介绍了主流微惯性器件MEMS结构与ASIC的MCMSoC系统集成技术现状,并对各集成方案特点进行了分析对比。此外,对微惯性器件MEMS与ASIC系统集成的关键技术进行了总结。最后,简要分析了国内外差距并展望了下一步发展趋势。

Review on the System Integration Technology of Micro Inertial Devices Based on the MCM&SOC Scheme

In recent years, with the continuous improvement of the SWaP index of the micro inertial device, the PCB functional circuit has been well replaced by application specific integrated circuits (ASICs), due to the requirements of guidance and control applications in aerospace industry, military equipment and high-end industry. Considering the factors of fabrication complexity, including the cost and performance potential, the multi-chip module (MCM) and system-on-chip (SoC) schemes of the system integration of MEMS structure and ASIC have become the current mainstreams. The integration schemes for the representative inertial devices are well introduced and analyzed in a classified manner. In addition, the key technologies for developing these devices are listed. Finally, the technical gap between home and abroad is briefly analyzed and the development trend is forecasted.