| 基于SPC的航电产品锡膏印刷检测技术研究与应用 |
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| 引用本文： | 袁源,胡旻,王大伟,江唯思.基于SPC的航电产品锡膏印刷检测技术研究与应用[J].航空电子技术,2019,50(3):45-50. |
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| 作者姓名： | 袁源 胡旻 王大伟 江唯思 |
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| 作者单位： | 中国航空无线电电子研究所,上海,200241;总参陆航部驻上海地区军事代表室,上海,200233 |
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| 摘 要： | 通过锡膏印刷检测系统在表面组装生产线的应用，在前端工序便可筛选不良品，而评价航空电子产品质量的可靠性不能笼统地判断其是否合格，更需要关注其“一致性”和“稳定性”。着眼于锡膏印刷检测SPI的数据统计分析，开创性地将统计过程控制（SPC）方法引入了航空电子产品SMT产线，结合工序能力指数评价报告和Xbar-S控制图，创建了一种科学高效的锡膏印刷质量的监控模型，防止大规模缺陷产品的出现。
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| 关 键 词： | 锡膏印刷检测(SPI) 数据分析 统计过程控制 |
| 收稿时间： | 2019/6/10 0:00:00 |
Research and Application of Solder Paste Inspection for Avionics Product based on SPC |
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| Institution: | China National Aeronautical Radio Electronics Research Institute, Shanghai 200241, China;;Army Aviation Representative office, General Staff, PLA, Shanghai 200233, China |
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| Abstract: | The application of Solder Paste Inspector system in the Surface Mounting line screened out the defective products in the front-end process. However, the evaluation of the reliability of avionics was not a general conclusion whether the product is acceptable; more attention should be paid to the consistency and stability of products. Focused is laid on the statistical analysis of solder paste printing inspection. By pioneering the Statistical Process Control into the avionics SMT line, the Process Capability Index report and X bar-S control chart are accomplished. And a scientific and efficient quality monitoring system for solder paste printing is established to prevent the emergence of defective products on a large scale. |
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| Keywords: | solder paste inspector(SPI) data analysis statistical process control |
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