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PCB高稳定性化学镀铜工艺研究
引用本文:曾为民,曾经倩,等.PCB高稳定性化学镀铜工艺研究[J].南昌航空工业学院学报,2001,15(1):46-48.
作者姓名:曾为民  曾经倩
作者单位:南昌航空工业学院材料科学与工程系!江西南昌330034(曾为民,曹经倩,吴纯素),北京科技大学材料科学与工程系!北京100083(吴荫顺)
摘    要:通过正交试验得到了化学镀铜速率适中而稳定性极高的化学镀铜工艺;采用PdCl2加速分解实验研究了多元合剂化学镀铜液的稳定性。结果表明:使用多元络合剂时存在交互作用可大大延长镀液的分解时间,同时使镀液的全面分解转变为少量颗粒上的缓慢分解。稳定剂的加入主要是抑制Cu^ 的生长,同时也降低了金属铜的生长速率。

关 键 词:印制版  化学镀铜  稳定性  正交试验  PCB  电镀  工艺
文章编号:1001-4926(2001)01-0046-03
修稿时间:2000年11月17

A Study on the Technique of Electroless Cu Deposition on PCB With High Stability
Zeng Weimin,Cao Jingqian,Wu Chunsu,Wu Yinshun.A Study on the Technique of Electroless Cu Deposition on PCB With High Stability[J].Journal of Nanchang Institute of Aeronautical Technology(Natural Science Edition),2001,15(1):46-48.
Authors:Zeng Weimin  Cao Jingqian  Wu Chunsu  Wu Yinshun
Institution:Zeng Weimin 1 Cao Jingqian 1 Wu Chunsu 1 Wu Yinshun 2
Abstract:The technique of electroless copper deposition on printed circuit boards (PCB)with high stability and moderate rate is obtained by orthogonal experimenting and stability of multicomplexing electroless copper deposition is studied by adding PdCl 2 in solution.The results show that decomposing time of solution can be much prolonged and the overall decomposing of solution is transformed into slow and partial decomposing on few grains when using multicomplexing.Stabilizer plays a role in restraining Cu + and Cu 0 from producing.
Keywords:Printed circuit boards  Electroess copper deposition  Multicomplexing agent  Stability  
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