| QFP焊点形态预测及可靠性分析 |
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| 引用本文： | 王考,陈循,褚卫华.QFP焊点形态预测及可靠性分析[J].强度与环境,2004,31(1):40-45. |
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| 作者姓名： | 王考 陈循 褚卫华 |
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| 作者单位： | 国防科技大学机电工程与自动化学院机电工程研究所,湖南,长沙,410073 |
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| 摘 要： | 本文根据液态焊料润湿理论和最小能量原理对QFP焊点的几何形态进行了预测。采用统一型粘塑性Anand本构方程描述焊点的粘塑性力学行为，通过非线性有限元方法研究焊点在热循环作用下的应力应变关系，基于疲劳寿命预测公式对焊点的热疲劳寿命进行预测。
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| 关 键 词： | QFP焊点 几何形态 可靠性分析 非线性有限元方法 热疲劳寿命 粘塑性 电子产品 |
| 文章编号： | 1006-3919(2004)01-0040-06 |
| 修稿时间： | 2003年5月30日 |
Shape prediction and reliability analysis of QFP solder joint |
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| WANG Kao,CHEN Xun,CHU Wei-hua.Shape prediction and reliability analysis of QFP solder joint[J].Structure & Environment Engineering,2004,31(1):40-45. |
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| Authors: | WANG Kao CHEN Xun CHU Wei-hua |
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| Abstract: | In this paper, the geometry of solder joint of QFP is predicted according to the moist theory of liquid solder material and the principle of minimum energy. The unified viscoplastic Anand constitutive equation is employed to represent the viscoplastic deformation behavior of solder joint. The relation between stress and strain of solder joint is studied by means of nonlinear finite element method. Based on the equation of fatigue life prediction, the thermal fatigue life of solder joint is predicted. |
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| Keywords: | reliability solder joint nonlinear finite element method thermal fatigue life viscoplatic |
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