| LCCC电子封装结构的热疲劳寿命分析 |
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| 引用本文： | 侯传涛,童军,荣克林.LCCC电子封装结构的热疲劳寿命分析[J].强度与环境,2014(3):51-57. |
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| 作者姓名： | 侯传涛 童军 荣克林 |
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| 作者单位： | 北京强度环境研究所,北京100076 |
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| 摘 要： | 以典型LCCC电子封装结构为研究对象,分别基于有限元仿真分析方法和工程算法开展电子封装结构在温循载荷作用下的疲劳寿命分析,分析结果表明,有限元仿真分析方法和工程算法所预测的结构疲劳寿命一致性较好。所探索的有限元方法和工程估算方法在解决电子封装结构的热疲劳寿命问题时具有很好地推广性。
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| 关 键 词： | 疲劳寿命 LCCC封装 温循载荷 有限元 syed模型 |
Thermo-fatigue life study on LCCC electronic packaging structure |
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| HOU Chuantao,TONG Jun,RONG Kelin.Thermo-fatigue life study on LCCC electronic packaging structure[J].Structure & Environment Engineering,2014(3):51-57. |
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| Authors: | HOU Chuantao TONG Jun RONG Kelin |
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| Institution: | ( Beijing Institute of Structure and Environment Engineering, Beij ing 100076, China) |
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| Abstract: | Basing on the FEM and theory methods, Thermo-fatigue life of LCCC electronic packaging structure is investigated. The analysis outcomes show that the Fatigue life predicated by FEM is associated with the result of the theory method. The techniques explored by this paper are extended conveniently to evaluate thermo-fatigue life for other electronic packaging structures. |
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| Keywords: | fatigue life LCCC electronic packaging cyclic temperature load FEM syed model |
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