卧矩台精密平面磨削纳米结构WC/12Co涂层材料去除机理

纳米结构陶瓷涂层具有优异的性能,但在工业应用中不但其涂层制备技术而且其精密磨削技术对涂层的使用性能均具有重要影响,因此对其磨削时的材料去除机理的研究成为必要。本文就磨削参数对纳米结构W C/12Co(n-W C/12Co)涂层卧矩台精密平面磨削的磨削力分力比、比磨削能和磨削表面粗糙度的影响规律进行了试验研究,结合n-W C/12Co涂层精密平面磨削后的表面/亚表面形貌的SEM观察分析,揭示了n-W C/12Co涂层精密磨削的材料去除机理。研究结果表明,n-W C/12Co磨削的材料去除机理主要是非弹性变形方式,材料脆性去除方式较少。

Material Removal Mechanism of Surface Precision Grinding of Nanostructured WC/12Co Coating

Nanostructured ceramic coatings have excellent properties,but their industrial application depends on their fabrications and precision grinding technologies.It is necessary to study the material removal mechanism in grinding of nanostructured ceramic coatings.Experimental results on how the grinding parameters affect the grinding force ratio and specific grinding energy as well as surface roughness on precision surface grinding of nanostructured WC/12Co(n-WC/12Co) coatings are presented.SEM observations on the surface and the subsurface of the nanostructured WC/12Co coating ground are made under different grinding conditions.The material removal mechanism in grinding of n-WC/12Co coatings is discussed.The study show that the mechanism is mainly due to inelastic deformation instead of brittle fracture,thus providing a theoretical basis for the precision grinding of the nanostructured ceramic coating.