| 采用催化剂的化学镀锡新工艺的研究 |
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| 引用本文： | 梅天庆,冯辉.采用催化剂的化学镀锡新工艺的研究[J].南京航空航天大学学报,2002,34(3):262-265. |
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| 作者姓名： | 梅天庆 冯辉 |
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| 作者单位： | 1. 南京航空航天大学材料科学与技术学院,南京,210016
2. 郑州轻工业学院化学工程系,郑州,450002 |
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| 摘 要： | 研究了化学镀锡液中的络合剂，还原剂和催化剂等因素对沉积速度和镀液的稳定性的影响，利用可在金属锡表面吸附的贵金属络合物K2PdF6]的催化作用，大幅度提高了沉积速度，并得到了较厚的化学镀锡层。
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| 关 键 词： | 化学镀 催化 镀锡层 化学工艺 沉积速度 络合剂 |
| 文章编号： | 1005-2615(2002)03-0262-04 |
| 修稿时间： | 2001年7月6日 |
New Process for Electroless Tin Plating Using Catalyst |
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| Mei Tianqing College of Material Science and Technology,Nanjing University of Aeronautics & Astronautics Nanjing ,P.R.ChinaFeng Hui.New Process for Electroless Tin Plating Using Catalyst[J].Journal of Nanjing University of Aeronautics & Astronautics,2002,34(3):262-265. |
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| Authors: | Mei Tianqing College of Material Science and Technology Nanjing University of Aeronautics & Astronautics Nanjing PRChinaFeng Hui |
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| Institution: | Mei Tianqing College of Material Science and Technology,Nanjing University of Aeronautics & Astronautics Nanjing 210016,P.R.ChinaFeng Hui Department of Chemical Engineering,Zhengzhou Institute of Light Industry Zhengzhou 450002,P.R.China |
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| Abstract: | Effect of complex agent, reducing agent and catalytic agent, etc. in electroless tin bath is studied on deposition rate and stability of tin bath. The deposition rate is greatly increased with catalysis of noble metal complex K 2 adsorbed on metal tin surface, so the thick electroless tin deposit is obtained. |
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| Keywords: | electroless plating tin plating catalysis thick tin deposit new process |
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