| 航天器用高性能塑封器件的板级鉴定方法 |
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| 引用本文： | 朱恒静.航天器用高性能塑封器件的板级鉴定方法[J].航天器环境工程,2008,25(1):87-90. |
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| 作者姓名： | 朱恒静 |
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| 作者单位： | 中国空间技术研究院电子元器件可靠性中心,北京,100029 |
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| 摘 要： | 由于技术进步和设计需要,航天应用中不可避免地会遇到选用低质量等级塑封器件的情况。随着器件功能的日益复杂和封装的多样化,实现器件级的鉴定越来越困难。文章提出了基于板级系统对塑封器件进行鉴定的方法,包括几个标准的评估方面,如器件级筛选、破坏性物理分析、特殊的设计评估等;并介绍了一种基于局部加热技术,能够考核器件热温度特性的板级评估方法。
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| 关 键 词： | 板级试验 塑封器件 鉴定 故障覆盖率 |
| 文章编号： | 1673-1379(2008)01-0087-04 |
| 收稿时间： | 2007/10/30 0:00:00 |
| 修稿时间： | 2007年10月30 |
Board-level testing for advanced PEMs in space applications |
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| Zhu Hengjing.Board-level testing for advanced PEMs in space applications[J].Spacecraft Environment Engineering,2008,25(1):87-90. |
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| Authors: | Zhu Hengjing |
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| Institution: | Electronic Components Reliability Center, China Academy of Space Technology, Beijing 100029, China |
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| Abstract: | During the technological development and design,it is inevitable that one has to use some available components not very reliable for space applications. Due to the complicity of the component's functions and the variety of device's packaging,the component level testing is getting more and more difficult. The suggested qualification system in this paper is based on board-level functional testing of the parts and includes several standard elements of the qualification system,such as the destructive physical analysis (DPA),special design evaluations,and innovative qualification methods. An example of monitoring temperature transients and based on the local heating technique is described. |
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| Keywords: | board-level test plastic packaging components qualification fault coverage |
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