| 塑封微电路老炼研究综述 |
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| 引用本文： | 王伟明,郝红伟,李青峰,马伯志,李路明.塑封微电路老炼研究综述[J].航天器环境工程,2011,28(1):56-62. |
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| 作者姓名： | 王伟明 郝红伟 李青峰 马伯志 李路明 |
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| 作者单位： | 清华大学,航空航天学院,北京,100084 |
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| 基金项目： | 国家自然科学基金（项目编号：60906050/F040604） |
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| 摘 要： | 文章介绍了塑封微电路在高可靠性领域的应用,塑封微电路可靠性研究的现状,以及塑封微电路老炼研究在塑封微电路可靠性研究中的地位.具体分析了商用塑封器件老炼当前所面临的主要问题,其中重点介绍了随着器件集成度和工艺水平的提高,元器件漏电流的增加和元器件参数差异增大是老炼研究中不可忽略的因素.针对上述问题,指出了塑封微电路老炼过...
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| 关 键 词： | 塑封微电路 老炼试验 热稳定性 高可靠性 |
| 收稿时间： | 2010/8/24 0:00:00 |
A review of studies of burn-in of plastic encapsulated devices |
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| Wang Weiming,Hao Hongwei,Li Qingfeng,Ma Bozhi and Li Luming.A review of studies of burn-in of plastic encapsulated devices[J].Spacecraft Environment Engineering,2011,28(1):56-62. |
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| Authors: | Wang Weiming Hao Hongwei Li Qingfeng Ma Bozhi and Li Luming |
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| Institution: | School of Aerospace, Tsinghua University, Beijing 100084, China;School of Aerospace, Tsinghua University, Beijing 100084, China;School of Aerospace, Tsinghua University, Beijing 100084, China;School of Aerospace, Tsinghua University, Beijing 100084, China;School of Aerospace, Tsinghua University, Beijing 100084, China |
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| Abstract: | This paper reviews the application of plastic encapsulated devices in fields requiring high reliability, and the burn-in tests to check its reliability, with emphasis on the impacts of the increase of leakage currents and parameter variations accompanied with the improvement of integration extent and processing technology, which would become crucial where stressed voltage and temperatures are applied. Therefore, it is very important to carry out thermal stability study in the burn-in tests of plastic encapsulated device in order to achieve high reliability. |
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| Keywords: | plastic encapsulated devices burn-in test thermal stability high reliability |
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