基于叶脉仿生的散热均热板性能研究

为了解决航空电子芯片持续高强度工作下的集成散热问题，从而保证电子热表面均温无噪声，受植物叶片蒸腾作用的启发，设计了配备有树状分叉叶脉仿生分形结构吸液芯的均热板，并探究分形结构类型、分形级数、分形角度、入口流速和输入功率等参数对新型吸液芯内流体流动性能的影响；深入研究叶脉仿生均热板的传热特性，对比H型和Y型结构吸液芯在不同入口流速下的温度分布情况以及相对出口速度偏差值。数值模拟结果表明，在低热流密度下，Y型结构冷却效果明显好于H型结构；当热流密度较大时，分叉路口的紊流增强换热，使得H型结构冷却效率高于Y型结构。实验发现，Y型结构蒸发底板具有优越的传热性能，而H型结构和平面型蒸发底板在高功率工况下传热趋于稳定和良好。

The performance of vapor chamber based on leaf-vein-like structure for heat dissipation

To realize an adequate heat dissipation for the integrated avionics chip under a continuous high-intensity operation, so as to avoid the noise on the electronic hot surface by homeothermy techniques, a vapor chamber equipped with the bionic wick of the tree branch vein is designed, as inspired by the structure of the plant vein, and the influence of the bifurcation structure type, the fractal series, the fractal angle, the inlet velocity and the input power on the fluid flow performance in the novel wick is studied. Then, the thermal characteristics of the vapor chamber with the leaf vein are investigated, and the temperature distributions of the two types of wicks at different inlet velocities are compared. Analytical results show that the cooling effect of the Y-type structure is better than that of the H-type structure under a low heat flux density; for a high heat flux, the turbulent flow at the bifurcation enhances the heat transfer, so the cooling efficiency of H-type structure is better. The experimental results show that the Y-type evaporation chassis has a superior heat transfer performance, while the H-type and the plane type evaporation floor tend to behave better under high-power conditions.