| 构建数学模型 优化贴装过程 |
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| 引用本文： | 刘建,王俊红,周彤.构建数学模型 优化贴装过程[J].华北航天工业学院学报,2008(6). |
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| 作者姓名： | 刘建 王俊红 周彤 |
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| 作者单位： | 北华航天工业学院电子工程系; |
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| 摘 要： | 贴装优化问题直接关系到表面贴装工艺的效率。本文以JUKI-2010/2020贴片机为试验平台,根据该机型结构及贴装过程,把贴装优化问题的描述为最小权重匹配问题(MWMP)以及非对称旅行商(TSP)问题,构建了一种新的优化模型:把时间优化转化为距离优化,并应用启发式算法进行软件编程。通过生产企业的6块PCB板的对比实验,证明了该数学模型和算法是合理的。
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| 关 键 词： | 贴装优化 最小权重匹配问题 旅行商问题 启发式算法 |
Building a Mathematical Model,Optimizing Mount Process |
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| LIU Jian WANG Jun-hong ZHOU Tong.Building a Mathematical Model,Optimizing Mount Process[J].Journal of North China Institute of Astronautic Engineering,2008(6). |
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| Authors: | LIU Jian WANG Jun-hong ZHOU Tong |
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| Institution: | LIU Jian WANG Jun-hong ZHOU Tong(Electronic Engineering Department,North China Institute of Aerospace Engineering,Langfang 065000,China) |
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| Abstract: | Mount optimization problems are directly related to the efficiency of surface-mount technology.In this paper,depending JUKI-2010/2020 Mounter as test platform,according to the model structure and mount process,mounting the optimization described as the minimum weight matching(MWMP) and asymmetric traveling salesman problem(TSP),building a new optimization model:optimize the time into a distance optimization,heuristics and application software programming.the comparative experiment through the six PCB boards... |
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| Keywords: | mount optimization minimum weight match problem traveling salesman problem heuristics |
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