航天器多功能结构传热特性的实验研究(英文)

针对航天器结构高性能、轻质化和集成化的发展要求,设计了集电路控制,热管理功能和结构承载功能于一体的多功能结构。此种结构分别采用柔性电路板控制热仿真多芯片模块,作为多功能结构的热源;碳碳材料作为热倍增器;复合材料蒙皮和金属泡沫芯子的夹层结构作为承载结构,实现了结构和功能的集成。同时,为了研究多功能结构的传热特性,进行了热真空实验,实验测量了热流密度和温度梯度。结果表明这种新型的结构可以消散飞行器多芯片模块产生的热量,碳碳热倍增提供了一种减小温度梯度的新方法,同时这种多功能结构减少了结构的体积,降低了结构的质量。

Experimental Research on Heat Transfer in a Novel Multi-functional Structure

A novel multi-functional structure capable of managing heat flux and carrying structural loads is investigated to develop the aerospace structure with high performance,light-mass and integration.A multi-functional structure is consisted of multichip modules used as the heat source,carbon-carbon material as thermal doublers and composite structural panel with metal foam as bearing structure thus complementing the integration of structures and functions respectively.To study the heat transfer in the multi-functional structure,heat flux and temperature gradient are measured by thermal vacuum tests.Results show that this multifunctional structure is a light mass structure and can implement realistically to eliminate high heat load generated by the multichip modules.Moreover,the C-C heat doublers offer an approach to reduce the temperature gradient.