| 利用热阻网络拓朴关系对多芯片组件热分析技术的研究 |
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| 引用本文： | 曹玉生,刘军,施法中.利用热阻网络拓朴关系对多芯片组件热分析技术的研究[J].宇航学报,2006,27(3):527-530. |
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| 作者姓名： | 曹玉生 刘军 施法中 |
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| 作者单位： | 1. 北京航空航天大学机械工程及自动化学院,北京,100083
2. 中国航天时代电子集团民芯公司,北京,100076 |
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| 摘 要： | 与单芯片封装相比，对多芯片组件（MCM：Multi—Chip Module）进行热分析时，由于存在多个热源，各个热源之间相互影响，使得热分析变得比较复杂。现通过几种基本的MCM类型，利用一维热阻网络拓朴关系进行了热场的计算和分析，并与有限元仿真结果进行了对比，得到结点温度与有限元仿真结果误差相差不超过10％，说明了利用热阻网络拓朴分析技术可在某种程度上应用于3D MCM组件的热学分析技术中。
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| 关 键 词： | 多芯片组件(MCM) 热分析 热阻 |
| 文章编号： | 1000-1328（2006）03-0527-04 |
| 收稿时间： | 06 21 2005 12:00AM |
| 修稿时间： | 2005-06-212005-09-19 |
The Study of Thermal Analysis of Multi-Chip Module by Thermal Resistor Network |
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| CAO Yu-sheng,LIU Jun,SHI Fa-zhong.The Study of Thermal Analysis of Multi-Chip Module by Thermal Resistor Network[J].Journal of Astronautics,2006,27(3):527-530. |
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| Authors: | CAO Yu-sheng LIU Jun SHI Fa-zhong |
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| Institution: | 1. Department of Machine Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China; 2. MinXin Corp. of China Aerospace Times Electronics Corporation, Beijing 100076, China |
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| Abstract: | Because of existing multi-powers and interacting each other,the thermal analysis of Multi-Chip Module(MCM) represents a much more complicated situation than encountered with single-chip packages.In this article the thermal field of several basic MCM structure are analyzed by thermal resistor net method.The result is compared with finite element analysis calculations.Getting the error which come into being between the thermal resistor network analysis and the finite element analysis is less than 10 percentage.It indicate that thermal resistor network analysis can be used to estimate heat analysis for 3D MCM in some extent. |
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| Keywords: | Multi-chip module Thermal analysis Thermal resistor |
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