| 基于石墨板的电子设备大功率器件散热方法研究 |
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| 作者姓名： | 崔冠宇 王宇 郭益 薛小龙 王雁翔 |
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| 作者单位： | 北京遥测技术研究所,北京遥测技术研究所,北京遥测技术研究所,北京遥测技术研究所,北京遥测技术研究所 |
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| 基金项目： | 国家自然科学基金重大科研仪器研制项目高速目标等离子体电磁信号多维度特征测量及通信技术研究(6162790108) |
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| 摘 要： | 针对宇航电子设备大功率器件的散热路径进行了分析。对顶部散热的器件采用高导热石墨板、精确控制导热垫压缩量、增加导热路径等方式进行散热,对腹部散热的器件采用覆铜通孔等方式进行散热,并结合热仿真和温循试验,有效解决了大功率器件散热问题。
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| 关 键 词： | 大功率器件 石墨板 热仿真 |
| 收稿时间： | 2021/7/20 0:00:00 |
| 修稿时间： | 2021/1/31 0:00:00 |
Research on heat dissipation method of high power components in electronic equipment based on graphite sheet |
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| Authors: | CUI Guanyu WANG Yu GUO Yi XUE Xiaolong and WANG Yanxiang |
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| Institution: | Beijing Research Institute of Telemetry,Beijing Research Institute of Telemetry,Beijing Research Institute of Telemetry,Beijing Research Institute of Telemetry,Beijing Research Institute of Telemetry |
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| Abstract: | This paper analyzes the heat dissipation path of the high power components in aerospace electronic equipment. High thermal conductivity graphite sheet, accurately control of heat conduction pad compression and increase of heat conduction path are used for component which heat dissipation through the top. Covering the vias with copper are used for component which heat dissipates through the bottom. Combined with thermal simulation and temperature cycle test, the heat dissipation problem of high power component is effectively solved. |
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| Keywords: | High power component Graphite sheet Thermal simulation |
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