宽带高集成多级射频互连技术

针对微波电路三维集成结构的迫切需求,开展宽带高集成多级射频互连技术研究。主要设计了两种电路结构,多级水平互连电路与多级垂直互连电路。多级水平互连电路中,通过优化同轴-微带线的水平过渡以及倒角过渡方式,得到在DC～30GHz内的仿真结果,回波损耗优于21dB,插入损耗优于0.16dB;多级垂直互连电路中,通过优化BGA板间互连结构,得到在DC～30GHz内的仿真结果,信号的回波损耗优于13dB,插入损耗优于0.57dB。在小型化、高集成的需求下,宽带高集成多级射频互连技术是解决宽带射频信号传输问题的关键技术路径,可以广泛应用在微波电路三维集成结构中,具有重大的应用前景。

Broadband and highly integrated multilevel RF interconnection technology

In order to meet the urgent need of three dimensional integrated structure of microwave circuit, the research of wideband high integrated multilevel RF interconnection technology is carried out. This paper mainly designs two kinds of circuit structures, multilevel horizontal interconnection design and multilevel vertical interconnection design. In the circuit of multilevel horizontal interconnection, by optimizing the horizontal transition between coaxial and microstrip lines and the chamfered transition mode, the simulation results show that the return loss is better than 21dB, and the insertion loss is better than 0.16dB within the DC~30GHz. In the multilevel vertical interconnection circuit, by optimizing the structure of BGA interplate interconnection, the simulation results show that the signal return loss is better than 13dB and the insertion loss is better than 0.57dB within the DC~30GHz. In the demand of miniaturization and high integration multilevel RF interconnection technology is the key path to solve the problem of wideband RF signal transmission. It can be widely used in the three dimensional integrated structure of microwave circuits and has great application prospect.