| 包覆药柱界面粘结质量的无损检测 |
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| 引用本文： | 蔡虹.包覆药柱界面粘结质量的无损检测[J].上海航天,2004,21(3):52-55. |
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| 作者姓名： | 蔡虹 |
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| 作者单位： | 上海新风化工研究所,浙江,湖州,313002 |
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| 摘 要： | 利用错位电子散斑干涉技术，对包覆药柱界面粘结质量无损检测方法进行了研究，分析了影响检测结果的间距、图像判读、加载量、灵敏度和内应力等关键因素。试验结果表明，此方法可以检测最小直径3.6mm的人工脱粘区。
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| 关 键 词： | 包覆药柱 界面粘结质量 错位散斑干涉 无损检测 |
| 文章编号： | 1006-1630(2004)03-0052-04 |
| 修稿时间： | 2003年2月17日 |
Non-Destructive Testing Method for the Interface Bonding Quality between Grain and Liner |
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| CAI Hong.Non-Destructive Testing Method for the Interface Bonding Quality between Grain and Liner[J].Aerospace Shanghai,2004,21(3):52-55. |
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| Authors: | CAI Hong |
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| Abstract: | The shearography was used to detect bonding quality of the interface between grain and liner. The key technologies of distance, image inspection, loading, sensitivity and inner stress that affected the test result were analyzed. It was showed that the least diameter 3.6 mm of artificial unbonding-area could be detected by the method. |
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| Keywords: | Grain with liner Bonding quality of the interface between grain and liner Shearography Non-destructive testing |
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